IC Package Keep-Out Zone With Hydrophobic Surface for Underfill Control
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Solution Overview
Problem
Existing IC packages face challenges in meeting reduced product form factor targets while increasing integration of heterogeneous electronic components, as current methods for preventing unwanted material spreading, such as trenches and barrier layers, are not scalable or customizable.
Innovation Solution
Implementing a keep out zone (KOZ) with a hydrophobic surface on the supporting layer, created using laser technology to form microscopic features that control material flow, allowing for precise and customizable prevention of epoxy and mold underfill spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional trenches or barrier layers are used to prevent material spreading, then material containment is improved, but device complexity and manufacturing scalability deteriorate
Solution Approach 1:
The patent changes the surface energy parameter of the supporting layer by applying a hydrophobic coating to specific regions. This creates keep-out zones where the hydrophobic surface prevents epoxy and mold underfill materials from adhering and spreading, thereby containing materials without requiring complex physical trenches or barrier layers.
Solution Approach 2:
The patent replaces mechanical containment structures (trenches, physical barriers) with a chemical/surface energy-based solution. The hydrophobic coating creates an energy barrier that passively prevents material spreading through surface tension effects, eliminating the need for complex mechanical containment features.
2Reliability
If larger keep out zones are created to prevent material spreading, then material containment is improved, but package area increases
Solution Approach 1:
The patent applies hydrophobic coating only to specific local regions of the supporting layer where keep-out functionality is needed, rather than creating large universal barriers. This localized treatment provides precise material containment at the smallest necessary area, allowing electronic components to be placed closer together and reducing overall package area.
3Manufacturing precision
If conventional material barriers are used to control epoxy flow, then manufacturing precision is improved, but adaptability to different products deteriorates
Solution Approach 1:
The patent creates a dynamic and flexible solution where hydrophobic coatings can be selectively applied to different regions of the supporting layer based on specific product requirements. This allows the keep-out zone pattern to be customized for different electronic component layouts and package designs while maintaining precise epoxy flow control through the hydrophobic surface properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables closer placement of electronic components, reducing package size and improving manufacturing tolerance, electrical performance, and cost efficiency, while being scalable and customizable for individual products.
Implementation Method 1
the second zone has a hydrophobic surface including surfaces of the multiple micro-pillars and surfaces of the base area, and wherein the second zone is a keep out zone to prevent the underfill material from entering the second zone
Data Source
AI summary
Embodiments herein describe techniques for an IC package including a supporting layer having a first zone and a second zone. An electronic component is placed above the first zone of the supporting layer. An underfill material is formed above the first zone of the supporting layer, around or below the electronic component to support the electronic component. The second zone of the supporting layer includes a base area and multiple micro-pillars above the base area, where any two micro-pillars of the multiple micro-pillars are separated by a gap in between. The second zone has a hydrophobic surface including surfaces of the multiple micro-pillars and surfaces of the base area. The second zone is a keep out zone to prevent the underfill material from entering the second zone. Other embodiments may be described and/or claimed.