IC Package Layout Design Estimator for Layer Optimization
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Solution Overview
Problem
Integrated circuit (IC) designers face challenges in designing IC package layouts due to lack of information about IP block design, stack-up, pin interconnection, power planes, wire widths, and layer requirements, leading to inefficient development efforts and costs.
Innovation Solution
A method and system for implementing an IC package layout design estimator that determines the number of layers, power and ground layers, and generates output based on estimated layers and power/ground layers, using factors like netlist, geometric information, and placement data to optimize routing and layer stack-up.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If IC package layout designers use trial-and-error approaches to determine the number of layers, then they can eventually complete the design, but the development effort and cost increase unnecessarily
Solution Approach 1:
The patent applies preliminary action by providing design guidelines and estimators that enable IC package layout designers to determine the optimal number of layers before starting the actual layout design. The system calculates required layers based on IP block characteristics, pin counts, and routing requirements in advance, eliminating the need for trial-and-error approaches during the design process.
2Productivity
If designers overuse layers to accommodate routing requirements, then routing can be achieved, but the identification of optimal layer count is sub-optimal
Solution Approach 1:
The patent implements feedback mechanisms through estimators that continuously evaluate routing requirements against the proposed layer configuration. The system provides feedback to designers about whether the current layer count is sufficient for routing demands, allowing for iterative optimization to achieve the minimal necessary layers while maintaining complete routing capability.
3Measurement precision
If thermal analyses are performed late in the design cycle, then post-layout thermal analysis can be conducted, but drastic changes or re-layout may be required
Solution Approach 1:
The patent applies preliminary action by incorporating thermal analysis capabilities early in the design cycle, before final routing and layout completion. The system enables preliminary thermal estimation based on initial layer configurations and routing plans, allowing designers to identify and address thermal issues before they require drastic redesigns or re-layout operations.
Data Source
AI summary
Disclosed are mechanisms for implementing an IC package layout design with an integrated circuit package design estimator. These mechanisms determine an estimated number of layers for an integrated circuit (IC) package design including one or more IC die designs, determine whether the estimated number of layers suffice to accommodate routing demands for the IC package layout design, determine a power layer and/or a ground layer based in part or in whole upon one or more factors, and generate an output for the IC package layout design based using at least the estimated number of layers and the power layer and/or the ground layer. These mechanisms use input including connectivity information, thermal effects, and/or IC placement information to determine estimates for the total number of layers, layer stack-up, power and ground plane assignment, and via libraries to guide IC package layout design.