IC Package Lead Array with Non-Horizontal Profile for Thermal Management
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving smaller footprints, higher reliability, and lower costs due to issues with clock rates, EMI radiation, thermal loads, and assembly reliability, while also increasing complexity and error risks during manufacturing.
Innovation Solution
The development of an integrated circuit packaging system with a lead array having an innermost space and leads with unique profiles, where the innermost lead has a non-horizontal side and the middle lead has a consistent profile, along with a package encapsulation that includes a sealing filler to improve thermal performance and prevent mold bleeding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If current packaging technologies are used to achieve smaller footprints, then device size is reduced, but thermal loads and EMI radiation increase
Solution Approach 1:
The lead array is segmented into multiple leads with different profiles (innermost lead with non-horizontal side, middle leads with consistent profile). This segmentation allows different regions of the package to handle thermal and EMI challenges differently, with the innermost lead configuration providing enhanced thermal pathways while maintaining compact footprint.
Solution Approach 2:
The innermost lead is given a unique non-horizontal side profile while middle leads have consistent profiles. This local differentiation optimizes thermal management at the critical innermost region where the integrated circuit is placed, allowing improved heat dissipation precisely where needed without increasing overall package size.
2Reliability
If packaging complexity is increased to improve reliability, then assembly reliability improves, but manufacturing error risk increases
Solution Approach 1:
The innermost lead is designed with an asymmetric non-horizontal side profile while middle leads maintain symmetric consistent profiles. This controlled asymmetry provides enhanced mechanical interlocking and thermal pathways for improved reliability, while the regularity of middle leads keeps manufacturing complexity manageable through standardized processes.
3Ease of manufacture
If production costs are reduced by simplifying manufacturing, then cost decreases, but manufacturing precision may be compromised
Solution Approach 1:
The patent applies full precision manufacturing only to the critical innermost lead with its unique non-horizontal profile, while middle leads use simpler consistent profiles that require less precision. This partial application of high-precision manufacturing reduces overall production costs while maintaining sufficient precision for reliable assembly.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a lead array having an innermost space with an innermost lead having an inner lead profile different around an inner non-horizontal side of the innermost lead; forming a middle lead having a middle lead profile the same around a lead side of the middle lead; placing an integrated circuit in the innermost space adjacent to the innermost lead; and forming a package encapsulation over the integrated circuit, the innermost lead, and the middle lead.