Multi-Plane IC Package Interconnect Layout for Higher Lead Density
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Solution Overview
Problem
Existing integrated circuit (IC) packages face limitations in lead density due to the conventional arrangement of interconnects, which restricts the number of leads that can be packed within a given footprint, leading to inefficiencies in signal transmission and increased package size.
Innovation Solution
The IC package employs multiple interconnects encased in a mold compound, with leads arranged in interleaving rows to increase lead density, allowing for a pitch of less than 0.5 millimeters, such as about 0.32 mm, without reducing lead width or increasing package footprint, by using a first and second interconnect with leads protruding from opposing sides in different planes and being galvanically isolated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional interconnect arrangement is used, then manufacturing simplicity is maintained, but lead density is limited
Solution Approach 1:
The interconnect structure is divided into multiple independent interconnects (first interconnect and second interconnect), each with its own leads and die pad. This segmentation allows multiple lead sets to coexist within a single package, increasing lead density without compromising manufacturing simplicity
Solution Approach 2:
The second interconnect is positioned in a different plane (second plane spaced apart from first plane) than the first interconnect, utilizing the vertical dimension to pack more leads into the same footprint. This three-dimensional arrangement enables pitch reduction to less than 0.5mm while maintaining ease of manufacture
2Quantity of substance
If lead pitch is reduced to increase lead density, then more leads fit in given footprint, but lead width may be reduced compromising signal transmission
Solution Approach 1:
By arranging interconnects in multiple planes vertically stacked, the patent achieves pitch reduction to less than 0.5mm (e.g., 0.32mm) while maintaining adequate lead width. The vertical separation between planes prevents lead interference and allows sufficient width for each lead to maintain signal transmission capability
3Quantity of substance
If multiple interconnects are used to increase lead density, then lead density improves, but package complexity increases
Solution Approach 1:
Multiple independent interconnects (first interconnect and second interconnect with their respective leads and die pads) are merged into a single integrated package structure enclosed by one mold compound. This merging achieves high lead density while maintaining a unified, manageable package structure that does not significantly increase overall complexity
Data Source
AI summary
An integrated circuit (IC) package includes a mold compound. A first interconnect of the IC package is encased in the mold compound. The first interconnect includes a first set of leads protruding from a first side of the mold compound along a first row and a second set of leads protruding from a second side of the mold compound along a second row, wherein the first row and the second row are in a first plane. A second interconnect of the IC package is also encased in the mold compound. The second interconnect includes a third set of leads protruding from the first side of the mold compound along a third row and a fourth set of leads protruding from the second side of the mold compound along a fourth row. The third row and the fourth row are in a second plane.