Integrated Circuit Package With Lead Fingers Reducing Height
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Solution Overview
Problem
Current integrated circuit package systems face challenges in achieving low-cost manufacturing, improved yield, and reliability while minimizing size and weight, particularly in portable devices where miniaturization and increased density are critical.
Innovation Solution
A mountable integrated circuit package system is developed, which includes a substrate with an opening and an encapsulated package with an external leadfinger, allowing for the mounting and connection of the package to the substrate, thereby reducing package height and enabling additional stacking, while partially exposing the leadfinger for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional wire bonding is used to connect the semiconductor die to the lead frame, then electrical connections are established, but manufacturing cost increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts the wire bonding process from the packaging system by providing lead fingers that are directly integrated with the semiconductor die bond pads. This eliminates the need for separate wire bonding steps, reducing manufacturing cost and complexity while maintaining reliable electrical connections through the direct lead finger-die interface.
Solution Approach 2:
The patent merges the lead frame function with the semiconductor die by integrating lead fingers directly onto the die surface. The lead fingers are formed as part of the die structure, combining the functions of electrical connection and mechanical support into a single integrated component, thereby eliminating wire bonding requirements.
2Length of stationary object
If the package height is reduced through miniaturization, then the size of portable devices decreases, but the complexity of achieving reliable connections increases
Solution Approach 1:
The patent transitions from vertical wire bonding connections to horizontal planar lead finger connections on the die surface. By arranging lead fingers in a planar configuration rather than requiring vertical wire loops, the package height is reduced while maintaining reliable electrical connections through the flattened connection geometry.
Solution Approach 2:
The patent segments the lead frame into multiple discrete lead fingers that are individually formed on the semiconductor die. Each lead finger is a separate conductive element that can be independently configured and connected, allowing for reduced package height while maintaining connection reliability through distributed contact points.
3Quantity of substance
If multi-chip packages are used to increase integrated circuit density, then the number of circuits per package increases, but the manufacturing cost and complexity increase
Solution Approach 1:
The patent creates a universal packaging platform where the semiconductor die with integrated lead fingers can serve multiple functions: as the active circuit component, as the interconnect structure, and as the mounting substrate. This multi-functionality allows multiple chips to be packaged together using the same basic structure, increasing circuit density without proportionally increasing manufacturing complexity or cost.
Data Source
AI summary
A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting the external leadfinger and the substrate.