IC Package Linear Through Channel Mounting Structure
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Solution Overview
Problem
Conventional integrated circuit package systems face challenges in achieving low cost manufacturing, improved yield, and reliability while accommodating the increasing demand for miniaturization and higher performance in portable devices, with existing solutions failing to provide effective solutions.
Innovation Solution
The integrated circuit package system features a mountable structure with contact and inner pads, utilizing linear through channels to connect the integrated circuit device between its sides, allowing for two levels of connectivity and enabling thinner profiles and higher packaging density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional semiconductor packages use resin molding or stacking approaches, then packaging density increases, but manufacturing cost and reliability improve insufficiently
Solution Approach 1:
The package structure is divided into distinct functional layers: a substrate layer with circuit traces, a semiconductor die layer with bonding pads, and an encapsulant layer. This segmentation allows each layer to be optimized and manufactured separately using standard processes, reducing overall manufacturing cost while maintaining high packaging density.
Solution Approach 2:
The semiconductor die is mounted directly onto the substrate in a flip-chip configuration, with the die partially embedded into recesses of the substrate. The encapsulant then surrounds and protects these nested components. This nesting approach maximizes packaging density while using conventional manufacturing techniques.
2Volume of moving object
If package size is reduced for miniaturization, then portability improves, but manufacturing yield and reliability deteriorate
Solution Approach 1:
The invention transitions from planar packaging to three-dimensional vertical stacking with the semiconductor die mounted face-down on the substrate and encapsulated above. This vertical dimension allows compact packaging while maintaining adequate spacing and connection reliability through controlled collapse of the encapsulant.
Solution Approach 2:
The substrate is prepared in advance with recesses formed at specific locations before die mounting. These pre-formed recesses guide the die placement and encapsulant flow, ensuring proper positioning and reliable electrical connections even in miniaturized packages.
3Productivity
If linear through channels are used to connect integrated circuit device sides, then electrical connection efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The encapsulant material is formulated to be conductive or to facilitate self-alignment of electrical connections during the curing process. The encapsulant automatically flows into and fills the spaces between the die and substrate, creating reliable electrical pathways without requiring complex external alignment or additional bonding steps.
Data Source
AI summary
An integrated circuit package system includes: providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.