IC Package Loading Plate With Liquid Cooling for Bare-Die Testing

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Solution Overview

Problem

High-density integrated circuit (IC) packages require significant compressive loads for reliable contact, which poses a risk of damage to bare-die packages, and there is a lack of infrastructure for testing with liquid-cooled heat dissipation systems, particularly for direct fluid impingement cooling.

Innovation Solution

An integrated loading mechanism that distributes the loading force across the IC package substrate, allowing for the use of custom thermal interface materials like liquid metal and enabling the implementation of liquid-cooled cold plates or direct fluid impingement cooling systems, with a movable nozzle plate for adjustable cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high compressive loads are applied to ensure reliable contact in high-density IC packages, then electrical connection reliability is improved, but the risk of damage to bare-die packages increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoiddie damage risk

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The loading force is segmented and distributed across multiple support structures (spacers and posts) positioned at different locations on the substrate, rather than concentrating the force at a single point. This distribution reduces the stress on any single area of the bare die while maintaining overall connection reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Compliant support structures (flexible spacers and posts) are introduced as intermediary elements between the loading mechanism and the IC package. These intermediaries absorb and distribute the compressive load, protecting the bare die from direct high-stress contact while ensuring reliable electrical connection.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If liquid-cooled cold plates or direct fluid impingement cooling systems are implemented, then thermal dissipation capability is improved, but device complexity increases

Engineering Contradiction:

Improvethermal dissipation capabilityVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The loading mechanism is designed to serve multiple functions: it provides mechanical support, applies compressive load for electrical contact, and simultaneously serves as the mounting structure for the cooling system. The support structures double as thermal pathways, reducing overall system complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling system is merged with the existing loading mechanism structure. The spacers and posts that provide mechanical support are also used as thermal conduction pathways to the cooling plate, eliminating the need for separate thermal management components and reducing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If custom thermal interface materials like liquid metal are used, then thermal efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The system allows for adjustable and adaptable thermal interface materials that can be selected or applied based on specific testing requirements. The compliant support structures accommodate different material properties, enabling easy switching between material types without requiring complete manufacturing process redesign.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances thermal efficiency, reduces the risk of die damage, and allows for high-volume testing of bare-die configurations, improving heat dissipation capabilities while maintaining control over temperature conditions.

Implementation Method 1

providing the liquid coolant to the plate... the liquid coolant to facilitate cooling of the integrated circuit package

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

allowing for the use of custom thermal interface materials like liquid metal... enabling the implementation of liquid-cooled cold plates

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250014967A1Methods and apparatus to improve thermal dissipation and mechanical loading of integrated circuit packages

Publication Date: 2025.01.09 INTEL CORP

AI summary

Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.