Load Mechanism for IC Package Heat Spreader Flatness
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Solution Overview
Problem
Existing load mechanisms for IC packages face challenges in applying an adequate force to ensure proper electrical and thermal contact, particularly for large packages, leading to issues with flatness and thermal coupling due to the application of force along perimeter regions of the heat spreader.
Innovation Solution
A load mechanism that applies force over a majority of the heat spreader's surface area, using a load plate with a step-like structure and thermal interface material to improve flatness and thermal conductivity, and includes a system of load levers and frame portions to distribute force effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If force is applied along perimeter regions of the heat spreader, then adequate load force is applied to ensure proper contact, but flatness of the heat spreader deteriorates causing thermal degradation
Solution Approach 1:
The heat spreader is segmented into a first region (perimeter) and a second region (central), with different functions assigned to each region. The first region provides load application contact while the second region maintains flatness for thermal coupling, resolving the contradiction between force application and shape maintenance.
Solution Approach 2:
Different regions of the heat spreader are given different local qualities: the first region is designed for mechanical load bearing while the second region is optimized for thermal conduction and flatness. This local differentiation allows the same component to simultaneously satisfy both force application and shape maintenance requirements.
2Reliability
If load is applied to ensure adequate socket contacts, then electrical contact reliability improves, but thermal coupling between heat spreader and die deteriorates
Solution Approach 1:
The heat spreader is divided into functionally distinct regions: the first region at the perimeter contacts the load mechanism for reliable electrical connection, while the second central region maintains intimate thermal contact with the die through its flat, unloaded surface.
Solution Approach 2:
The problem is solved by transitioning from a uniform single-function heat spreader to a multi-region structure where different zones serve different functions. The vertical dimension is also utilized with a stepped configuration that allows the perimeter region to be lowered for load contact while the central region remains elevated for thermal coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable socket contacts and enhanced thermal performance by distributing force across a larger area, reducing thermal degradation and improving the flatness of the heat spreader, thus maintaining the integrity of the thermal interface material.
Implementation Method 1
A thermal interface material is typically positioned between the heat spreader and the die
Implementation Method 2
The load travels though the heat spreader to the die. The socket may also be configured to accept a heat sink structure positioned on the IC package to transmit heat away from the package
Data Source
AI summary
Electronic assemblies and methods are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a package positioned in the socket, the package including a substrate, a die, and a heat spreader, the die positioned between the substrate and the heat spreader. The assembly also includes a load plate positioned on the heat spreader, the load plate covering a majority of the heat spreader, the load plate applying a force to the heat spreader that couples the package to the socket. Other embodiments are described and claimed.