Magnetic Shielding in IC Packages Using Composite Materials
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Solution Overview
Problem
Integrated circuit (IC) devices, particularly magnetoresistive random access memory (MRAM) devices, are vulnerable to external magnetic fields, which can interfere with their performance, and existing packaging solutions do not adequately shield these devices from such interference.
Innovation Solution
The use of magnetically conductive compounds, such as nickel (Ni), iron (Fe), and molybdenum (Mo) in composite materials, forming magnetic shields within the IC package to attenuate external electromagnetic fields, providing effective shielding through the incorporation of these materials in the molding compound and as separate shields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metallic shield in the form of a sheet or foil is provided adjacent to the IC device, then magnetic shielding is provided, but the package size and complexity increase
Solution Approach 1:
The patent combines the magnetic shielding function with the existing package substrate by incorporating magnetically conductive compounds into the molding compound material itself. This integration eliminates the need for separate metallic shield sheets or foils, reducing package complexity while maintaining magnetic shielding effectiveness through the composite material's inherent magnetic conductivity.
Solution Approach 2:
The patent uses composite materials by formulating the molding compound with magnetically conductive compounds (such as iron particles, nickel particles, or ferrite particles) dispersed within the polymer matrix. This composite approach provides magnetic shielding functionality without requiring traditional metallic shield layers, thereby simplifying the overall package structure while effectively attenuating external magnetic fields.
2Object-affected harmful factors
If magnetically conductive compounds are incorporated in the molding compound, then magnetic shielding is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes the concentration and particle size distribution of magnetically conductive compounds within the molding compound to achieve effective magnetic shielding. By carefully controlling these parameters—such as incorporating 1-10 weight percent of magnetic particles with specific size ranges—the patent achieves sufficient magnetic conductivity while maintaining ease of manufacturing through standard injection molding processes without requiring excessive precision.
Solution Approach 2:
The patent may vary the concentration or distribution of magnetically conductive compounds in different regions of the molding compound to optimize shielding effectiveness where needed while maintaining manufacturability. For example, higher concentrations of magnetic particles may be placed in regions closer to the IC device where magnetic field interference is most critical, while other regions use lower concentrations to reduce manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces external magnetic field interference by up to 60 decibels, ensuring the reliable operation of magnetically sensitive IC devices by incorporating magnetically conductive compounds in the IC package, enhancing both magnetic shielding and electrical insulation.
Implementation Method 1
magnetically conductive compounds, such as nickel (Ni), iron (Fe), and molybdenum (Mo) in composite materials, forming magnetic shields within the IC package to attenuate external electromagnetic fields
Implementation Method 2
The proposed solution effectively reduces external magnetic field interference by up to 60 decibels
Data Source
AI summary
An integrated circuit package including an integrated circuit die including a first side and a second side opposite the first side, the first side including at least one magnetoresistive device formed thereon. The integrated circuit package also may include a first magnetic shield disposed on or adjacent the first side of the integrated circuit die, wherein the first magnetic shield is formed of a composite material.