IC Package Magnetic Structure with Tapered Via Geometry
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Solution Overview
Problem
Conventional techniques for forming magnetic structures in integrated circuit (IC) packages face challenges such as inadequate dimension control, high manufacturing costs, and reliability issues, particularly with high aspect ratio vias, which are difficult to fabricate and prone to cracking.
Innovation Solution
A process flow is developed that includes forming a magnetic structure with a tapered shape around a conductive line, using a cavity to control dimensions and avoid the need for masks, and employing a semi-additive process for via formation, which improves manufacturability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional techniques are used to form magnetic structures, then manufacturing simplicity is maintained, but dimension control is inadequate and manufacturing precision deteriorates
Solution Approach 1:
A cavity is formed in the substrate before depositing the magnetic material. This preliminary action defines the precise dimensions and location of the magnetic structure, ensuring accurate dimension control while simplifying the overall manufacturing process by eliminating the need for complex masking steps.
2Reliability
If high aspect ratio vias are used to connect conductive lines, then electrical connectivity is achieved, but reliability deteriorates due to cracking and fabrication difficulty
Solution Approach 1:
The via aspect ratio is optimized by adjusting the via depth and diameter parameters. shallower, wider vias are used instead of deep, narrow vias, which reduces stress concentration and cracking while maintaining electrical connectivity. This parameter optimization makes the via fabrication process more reliable and easier to manufacture.
3Manufacturing precision
If magnetic structures are formed without cavities, then process steps are reduced, but bridging risk increases and manufacturing precision deteriorates
Solution Approach 1:
A cavity is formed in the substrate before depositing the magnetic material. This preliminary action defines the precise dimensions and location of the magnetic structure, ensuring accurate dimension control while simplifying the overall manufacturing process by eliminating the need for complex masking steps.
Solution Approach 2:
The cavity approach extracts the dimension control function from the magnetic deposition process itself. By pre-forming the cavity, the magnetic material simply fills the defined space, eliminating the need for precise deposition control and masking, thus improving both precision and manufacturability.
4Manufacturing precision
If masks are used to define magnetic structure locations, then positioning accuracy is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The cavity approach extracts the dimension control function from the magnetic deposition process itself. By pre-forming the cavity, the magnetic material simply fills the defined space, eliminating the need for precise deposition control and masking, thus improving both precision and manufacturability.
Solution Approach 2:
The cavity acts as an intermediary structure that defines the magnetic material's location and dimensions. Instead of using masks to control deposition, the cavity physically confines the magnetic material, simplifying the process while maintaining precision.
Data Source
Figure 1A~1D
Figure 1E~1I
Figure 1J~2C
AI summary
Disclosed herein are magnetic structures in integrated circuit (1C) package supports, as well as related methods and devices. For example, in some embodiments, an 1C package support may include a conductive line and a magnetic structure around a top surface of the conductive line and side surfaces of the conductive line. The magnetic structure may have a tapered shape that narrows toward the conductive line.