IC Package Marking Plate Structure for Warpage and Heat Dissipation

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Solution Overview

Problem

Existing IC packages face challenges with distortion during high-temperature processing, laser penetration issues, and thermal conductivity limitations due to the mismatch in thermal expansion and material properties between the plastic structure and the marking plate.

Innovation Solution

Incorporating a marking plate with higher rigidity and better anti-laser penetration properties, made from materials like silicon or ceramic, which matches the thermal expansion coefficient of IC chips and is embedded within a plastic structure, allowing for reduced package thickness and improved heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a plastic structure is used to encapsulate IC chips and marking plate, then the package has good molding flexibility and cost-effectiveness, but the package exhibits distortion during high-temperature processing due to thermal expansion mismatch

Engineering Contradiction:

Improvemolding flexibilityVSAvoidpackage warpage

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent employs a composite structure consisting of a plastic molding compound (epoxy resin with glass fibers) combined with a marking plate having specific thermal expansion properties. The marking plate is integrated into the plastic structure to create a composite package assembly that balances molding flexibility with thermal stability, reducing warpage during high-temperature processing while maintaining manufacturing ease.

Inventive Principle:

Principle #40Composite materials

2Reliability

If the marking plate has high rigidity and anti-laser penetration properties, then the package resists laser damage and maintains structural integrity, but the package thickness increases

Engineering Contradiction:

Improveanti-laser penetrationVSAvoidpackage thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent optimizes the marking plate parameters including its thickness (0.5mm to 2.0mm), material composition (semiconductor material like silicon), and thermal expansion coefficient matching to achieve the required anti-laser penetration properties and structural rigidity while minimizing the overall package thickness. The marking plate is designed with precise dimensional parameters to balance protection and compactness.

Inventive Principle:

Principle #35Parameter changes

3Stability of the object's composition

If the marking plate material matches the thermal expansion coefficient of IC chips, then the package maintains dimensional stability during thermal processing, but the selection of materials becomes more restricted

Engineering Contradiction:

Improvedimensional stabilityVSAvoidmaterial selection

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by requiring only the marking plate portion to have thermal expansion properties matching the IC chips, while the plastic molding compound can have different properties optimized for molding and encapsulation. This localized requirement maintains dimensional stability at the critical chip-marking plate interface without restricting the overall material selection for the entire package structure.

Inventive Principle:

Principle #3Local quality

4Ease of manufacture

If the plastic structure is used for encapsulation, then the package has good cost-effectiveness and molding capability, but the thermal conductivity is insufficient for efficient heat dissipation

Engineering Contradiction:

Improvecost-effectivenessVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The marking plate serves as a thermal intermediary between the IC chips and the external environment. While the plastic molding compound provides cost-effective encapsulation, the marking plate with its superior thermal conductivity (being made of semiconductor material like silicon) acts as a heat transfer pathway, conducting heat away from the chips more efficiently than the plastic structure alone, thus reducing energy loss through improved heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces package warpage during thermal processing, enables thinner packages with more IC chips, and enhances thermal conductivity for efficient heat dissipation, ensuring proper IC chip performance.

Implementation Method 1

the marking plate has a better thermal conductivity than the plastic structure. Thus, the marking plate can transfer heat generated by the IC chips during operation to the outer surface of the IC package

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3834227B1IC package

Publication Date: 2024.09.04 YANGTZE MEMORY TECH CO LTD

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AI summary

An integrated circuit package(100) which includes a package substrate(110), one or more IC chips(120), a marking plate(150) and a plastic structure(140). The one or more IC chips(120) are interconnected with the package substrate(110). The marking plate(150) has a first major surface and a second major surface. The marking plate(150) is stacked on the one or more IC chips with the first major surface facing the one or more IC chips(120). The plastic structure(140) is configured to encapsulate the one or more IC chips(120) and the marking plate(150) with the second major surface of the marking plate(150) being a portion of an outer surface of the IC package(100).