IC Package Metal Posts for 3D Die Heat Dissipation
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Solution Overview
Problem
Integrated circuit (IC) packages face challenges in efficiently dissipating thermal energy generated by increasingly functional and faster semiconductor dies, particularly in three-dimensional (3DIC) packages with multiple stacked dies, where the thermal dissipation capacity is often exceeded.
Innovation Solution
The integration of metal posts thermally coupled to a semiconductor die and an interposer substrate, which facilitates the dissipation of thermal energy through the metal posts and interconnects into the interposer substrate, enhancing heat dissipation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the functionality and operational speed of a die are increased, then the performance of the IC package is improved, but the thermal energy generated within the die increases and exceeds the thermal dissipation capacity of the IC package
Solution Approach 1:
The patent divides the thermal dissipation function into multiple separate metal posts distributed across the die surface, rather than relying on a single thermal path. Each metal post acts as an independent thermal conduit, segmenting the heat flow to improve overall dissipation capacity while maintaining electrical functionality.
Solution Approach 2:
The patent introduces metal posts as intermediary thermal conduction elements between the die and the interposer substrate. These posts serve as a dedicated thermal pathway that mediates heat transfer from the high-speed die to the interposer, enabling efficient thermal management without interfering with electrical signal paths.
2Area of stationary object
If multiple dies are stacked in a 3DIC package to reduce cross-sectional area, then the package density is improved, but the thermal dissipation capacity is exceeded due to multiple heat-generating dies
Solution Approach 1:
The patent transitions thermal dissipation from a primarily planar approach to a three-dimensional approach by extending thermal pathways vertically through metal posts that penetrate through the die and connect to the interposer substrate. This vertical dimension provides additional thermal conduction paths that do not occupy lateral space, enabling effective heat management in compact 3DIC configurations.
Solution Approach 2:
The interposer substrate serves multiple functions simultaneously: it provides electrical interconnection between stacked dies through its metallization layers and via structures, and it acts as a thermal sink through the metal posts that conduct heat away from multiple dies. This multi-functionality resolves the contradiction by making a single component handle both electrical and thermal requirements.
3Temperature
If metal posts are added to thermally couple the die to the interposer substrate, then the thermal dissipation capability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the thermal management function with the existing interposer substrate structure. The metal posts are integrated into the interposer fabrication process and work in conjunction with the interposer's existing metallization and via structures. This merging approach adds thermal capability without creating entirely separate thermal management components, thereby limiting the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates thermal energy from the semiconductor die, improving the thermal management of IC packages and supporting the stacking of additional dies in 3DIC configurations by leveraging the interposer substrate's signal routing and thermal dissipation capabilities.
Implementation Method 1
metal post(s) thermally coupled to the die and a metal interconnect(s) in the interposer substrate... thermal energy dissipates from the die through the metal post(s) and through the coupled metal interconnect(s) into the interposer substrate
Data Source
AI summary
Integrated circuit (IC) package employing metal posts thermally coupling a die to an interposer substrate for dissipating thermal energy of the die are disclosed. In one aspect, the IC package includes a metal post(s) thermally coupled to the die. The metal post(s) is attached to metal interconnect(s) (e.g., metal trace, metal pad, metal line, metal plate) in the interposer substrate. In this manner, as thermal energy is generated in the die, this thermal energy dissipates through the metal post(s) and through the coupled metal interconnect(s) into the interposer substrate. Thus, metal interconnects, which are an available feature in an interposer substrate fabrication process, are deployed to form the foundation upon which metal posts are fabricated and thermally coupled to the die to provide heat dissipation for the die in the IC package.