Integrated Circuit Package Metal Substrate Interconnection
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Solution Overview
Problem
Conventional integrated circuit packages face issues with increased thickness due to build-up layers and core layers, material mismatch leading to electrical connection defects, and complex alignment errors in forming interconnection networks, which complicates the manufacturing process and requires larger tolerances for accurate alignment.
Innovation Solution
A method involving a metal substrate with die contacts that directly interconnect electronic die terminal contacts, followed by encapsulation with an insulator layer, simplifying the attachment process and reducing alignment errors by forming connections before subsequent layers, allowing for direct bonding or wire bonding without the need for successive build-up layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If build-up layers and core layer are formed to create interconnection network, then electrical connections are established, but package thickness is significantly increased
Solution Approach 1:
The patent forms the interconnection network and die contacts on the substrate before bonding the electronic die. This preliminary formation of the interconnection structure eliminates the need for subsequent build-up layers to create vias and conductive paths, thereby reducing package thickness while maintaining electrical connection reliability.
2Reliability
If build-up layers are formed successively to create interconnection network, then electrical connections are established, but alignment errors accumulate and manufacturing complexity increases
Solution Approach 1:
The interconnection network is formed in advance on the substrate with precisely positioned contact openings and conductive patterns. This preliminary structuring establishes accurate alignment references before die bonding, preventing accumulation of alignment errors that would occur with successive build-up layer formation.
Solution Approach 2:
The manufacturing process is segmented into distinct stages: substrate preparation with interconnection network formation, die bonding, and encapsulation. This segmentation allows each stage to be optimized independently, with the interconnection network formation stage focusing on precision alignment without the compounding effects of multiple subsequent layer deposits.
3Device complexity
If successive build-up layers, circuit connection patterns and side connection pattern are formed, then interconnection network is created, but larger tolerance is required for accurate alignment
Solution Approach 1:
The substrate is pre-configured with the complete interconnection network including all conductive patterns and contact openings before die bonding. This preliminary action consolidates the alignment requirements into a single fabrication stage, eliminating the need for multiple alignment operations with successive build-up layers and reducing the cumulative tolerance requirements.
4Reliability
If wire bonding is used to connect side circuit pattern to integrated circuit dies, then electrical connections are established, but process complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the interconnection network formation with the substrate fabrication process itself, creating direct bond pads on the substrate that align with the die contacts. This integration eliminates the separate wire bonding step, reducing manufacturing complexity while maintaining reliable electrical connections through direct bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more accurate and efficient integrated circuit package with reduced thickness and alignment errors, enabling direct and precise attachment of electronic dies to die contacts, thereby improving the reliability of electrical connections and simplifying the manufacturing process.
Implementation Method 1
the metal substrate directly interconnecting the die contacts
Implementation Method 2
forming an insulator layer on the first surface of the metal substrate of the assembly to encapsulate the die and the die contacts
Data Source
AI summary
A method of making an integrated circuit package includes: (a) forcing a circuit layered structure that includes a metal substrate and a circuit pattern, the metal substrate having opposite first and second surfaces, the circuit pattern including at least two spaced apart die contacts that protrude from the first surface of the metal substrate, the metal substrate directly interconnecting the die contacts; (b) bonding first and second terminal contacts of an electronic die to the die contacts, respectively; and (c) forming an insulator layer on the first surface of the metal substrate to encapsulate the die and the die contacts after step (b).