IC Package Metal Wall for Unobstructed Sensor Interface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in exposing interface regions of integrated circuit (IC) packages to the environment while preventing obstruction by molding materials, which can impede the functionality of sensors or output devices like temperature, pressure, or light emitting devices.
Innovation Solution
The IC package design includes a metal wall with distinct thickness regions, forming a mushroom or nail shape, that circumscribes the interface region and extends beyond the molding height, preventing the molding from obstructing the interface region and ensuring unobstructed environmental interaction or output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the interface region is exposed to the environment, then the sensor or output device can detect or emit environmental signals, but the molding material may breach and obstruct the interface region
Solution Approach 1:
A metal wall structure is introduced as an intermediary barrier between the molding material and the interface region. The metal wall extends from the first surface of the die and protrudes beyond the molding material, creating a physical shield that prevents the molding from breaching and obstructing the interface region while allowing the interface to remain exposed to the environment.
Solution Approach 2:
The protection mechanism transitions from a two-dimensional planar structure to a three-dimensional protruding structure. The metal wall extends vertically from the die surface beyond the molding height, adding a height dimension that creates a protective overhang. This dimensional extension allows the interface region to be exposed horizontally while being protected vertically by the protruding metal wall.
2Object-affected harmful factors
If a metal wall is added to protect the interface region, then molding obstruction is prevented, but device complexity increases
Solution Approach 1:
The metal wall structure is integrated with the die and molding components rather than being a separate assembly. The metal wall is formed as part of the package structure, extending from the die surface and working in conjunction with the molding material to create a unified protective configuration. This merging reduces the need for additional separate protective components.
Solution Approach 2:
The metal wall provides localized protection only at the interface region where it is needed, rather than enclosing the entire device. The protective structure is concentrated at the specific location where the interface exposes to the environment, allowing the rest of the package to maintain its standard molding structure without unnecessary complexity.
3Object-affected harmful factors
If the metal wall extends beyond molding height, then interface region is protected, but manufacturing precision requirements increase
Solution Approach 1:
The metal wall structure is formed on the die surface before the molding process. By establishing the protective metal wall in advance, the subsequent molding process can proceed without requiring precise height matching, as the metal wall already provides the necessary protection. This preliminary formation of the protective structure reduces the precision requirements for the molding operation.
Data Source
AI summary
An integrated circuit (IC) package includes a die having a interface region situated on a surface of the die. The interface region is configured to be exposed to an environment of the IC package. The IC package also includes a metal wall mounted on the surface of the die that circumscribes the interface region and extends from the surface of the die to a wall height. The metal wall has a first region and a second region that is stacked on the first region, the first region having a first thickness and the second region having a second thickness. The second thickness is greater than the first thickness. The IC package further includes a molding encasing a remaining portion of the die. The molding has a height that extends from the surface of the die to a level that is less than the wall height of the metal wall.