IC Package Mold Layout for Flexible I/O Pad Exposure
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Solution Overview
Problem
As package size decreases, there are challenges in providing pads for signal input/output, testing, thermal, and power purposes in desired geometries while protecting elements with mold material on integrated circuit (IC) packages, as conventional molding techniques limit pad placement to either side of the mold material and require draft angles and ejector pins.
Innovation Solution
The method involves applying a mask material over I/O pads on a metallization structure, allowing mold material to be applied and then removing it with the mask, enabling pads to be placed on at least three sides of the mold material without draft angles or ejector pins, thus providing greater flexibility in I/O pad placement and design options.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional molding techniques are used to protect elements on IC packages, then elements are protected by mold material, but pad placement is limited to either side of the mold material and requires draft angles and ejector pins
Solution Approach 1:
A mask material is applied to the metallization structure before the mold material is applied. The mask material defines the areas where mold material should not be placed, allowing pads to be exposed on multiple sides of the mold material. This preliminary masking action enables complex pad geometries without requiring complex molding processes.
Solution Approach 2:
The mask material is removed along with any mold material above it after the mold material has been applied and cured. This extraction process exposes the pads that were covered by the mask, allowing pads to be accessible on multiple sides of the mold material without requiring draft angles or ejector pins.
2Adaptability or versatility
If package size decreases to provide desired I/O pad geometries, then pad placement flexibility improves, but challenges increase in providing pads while protecting elements with mold material
Solution Approach 1:
The mask material is applied in advance to define the exact areas where mold material should be excluded, allowing complex pad geometries to be achieved even in small packages. This preliminary action simplifies the manufacturing process by decoupling pad geometry design from molding process constraints.
Solution Approach 2:
The mask material is selectively applied only to specific areas of the metallization structure where pad exposure is desired. This localized masking allows different regions of the package to have different properties - some areas covered by mold material for protection, and other areas exposed for pad access.
Data Source
AI summary
An integrated circuit (IC) package that is to be incorporated into a computing device may include a metallization structure with circuits and/or other elements such as capacitors or inductors thereon. Pads for input/output (I/O) (or other) purposes may also be present at different locations on the metallization structure. Exemplary aspects of the present disclosure allow mold material to be placed over the circuits and/or other elements in readily-customizable configurations so as to allow placement of the I/O pads in any desired location on the metallization structure. Specifically, before the mold material is applied to the metallization structure, a mask material such as tape may be applied to portions of the metallization structure that contain I/O pads or otherwise have reasons to not have mold material thereon. The mold material is applied, and the mask material is removed, taking unwanted mold material with the mask material.