IC Package Mold Locking for Larger Die and High I/O Density

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Solution Overview

Problem

Conventional semiconductor package systems face challenges in accommodating larger chip sizes and maximizing input/output density while maintaining low manufacturing costs and reliability, particularly in dual row QFN packages.

Innovation Solution

The integrated circuit package system incorporates dual rows of inner and outer leads with mold locking features, such as side locks and front outer locks, to securely connect and encapsulate the integrated circuit die, allowing for increased chip size and I/O density without impacting manufacturing tolerances.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional dual row QFN packages use staggered inner and outer leads to maximize lead density, then I/O density is improved, but the package cannot accommodate larger semiconductor die sizes

Engineering Contradiction:

ImproveI/O densityVSAvoidaccommodation of larger die sizes

Core Design Contradiction:

Quantity of substanceVSAdaptability or versatility

Solution Approach 1:

The lead frame is segmented into inner leads and outer leads with different configurations. Inner leads are positioned closer to the die center while outer leads extend to the package perimeter, creating distinct functional zones that accommodate both high I/O density and larger die sizes independently

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different lead regions are assigned different characteristics: inner leads provide dense I/O connections near the die center, while outer leads provide structural support and additional I/O at the package perimeter, allowing each region to optimize for its specific function

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If the package structure is modified to accommodate larger die sizes, then adaptability is improved, but manufacturing precision and tolerances deteriorate

Engineering Contradiction:

Improveaccommodation of larger die sizesVSAvoidmanufacturing tolerances

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The lead frame is pre-formed with integrated mold locks and precise lead configurations before die mounting. This preliminary structuring ensures that when larger dies are packaged, the alignment and positioning tolerances are already established, maintaining manufacturing precision across different die sizes

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The lead frame design serves multiple functions simultaneously: it provides electrical connections, mechanical support for the die, and integrated mold locking features. This multi-functionality allows the same structure to accommodate various die sizes while maintaining consistent manufacturing tolerances through standardized attachment and molding processes

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8039947B2Integrated circuit package system with different mold locking features

Publication Date: 2011.10.18 STATS CHIPPAC LTD

AI summary

An integrated circuit package system is provided including forming a first inner lead having a first inner bottom side and a first outer lead, forming a first side lock of the first inner lead above the first inner bottom side, connecting an integrated circuit die with the first inner lead and the first outer lead, and encapsulating the integrated circuit die and the first side lock.