IC Package Mould Insert for Die Exposure
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Solution Overview
Problem
Existing methods for manufacturing integrated circuit packages, such as QFN, LGA, and BGA, do not efficiently provide exposure and accessibility of package internals, limiting their versatility for applications requiring sensors and actuators.
Innovation Solution
A method involving a mould insert that creates an opening or recess during the encasement process, allowing for efficient batch separation of integrated circuit packages with die openings, enabling exposure and accessibility of die members from multiple sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a mould insert is used to create an opening or recess during encasement, then accessibility and exposure of die members is improved, but device complexity increases
Solution Approach 1:
The mould insert is divided into multiple segments or parts that can be independently positioned and removed. This segmentation allows the insert to create the necessary opening or recess in the package body while maintaining ease of removal after encasement, reducing the complexity of the overall mould structure.
Solution Approach 2:
The mould insert acts as an intermediary tool during the encasement process. It temporarily occupies the space where the opening should be formed, allows the encapsulant to be molded around it, and then is removed to leave the desired opening. This intermediary approach simplifies the overall process by separating the opening-formation step from the encasement step.
2Productivity
If batch wise separation of integrated circuit packages is implemented, then productivity is improved, but manufacturing precision may deteriorate
Solution Approach 1:
The mould insert is pre-positioned in the mould cavity before the encasement process begins. This preliminary positioning ensures that the opening or recess will be formed at the correct location and orientation in each package. When batches of packages are separated later, each package already has its opening properly formed, maintaining manufacturing precision while enabling efficient batch processing.
Solution Approach 2:
The mould insert creates a negative impression or copy of the desired opening shape in the package body during encasement. This copying process ensures that each package in the batch receives an identical, precisely-formed opening without requiring individual post-processing, thus maintaining both productivity and manufacturing precision.
3Manufacturing precision
If the mould insert spans across the cutting line, then die opening formation is improved, but cutting difficulty increases
Solution Approach 1:
The mould insert is designed to be removed or extracted from the mould cavity after the encasement process but before the cutting operation. By taking out the insert beforehand, the cutting process encounters no obstruction from the insert, eliminating the difficulty of cutting through the insert material while still allowing the insert to have formed the precise die opening in the package body.
Solution Approach 2:
The die opening is preliminarily formed by the mould insert during the encasement step, before the cutting operation takes place. This preliminary formation of the opening ensures precise positioning and geometry, while the actual cutting process then only needs to separate the packages along the cutting lines without having to cut through the insert itself, reducing cutting difficulty.
Data Source
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AI summary
Method of making an integrated circuit package, by a) providing a plurality of die members(4a, 4b) connected to respective electrical contact members (8a, 8b) in a mould;b) providing a mould insert in contact with at least a part of a first upper surface (6a) of a first die member (4a); c) encasing the plurality of die members (4a, 4b) and the respective electrical contact members (8a, 8b) into a package collection body (3); and d) cutting the package collection body (3) into at least two separate integrated circuit packages (3a, 3b)along a first cutting line (S1) extending through the package collection body (3) and separating the plurality of die members (4a, 4b). The mould 10 insert as provided in step b) extends across a part of the first cutting line (S1).