IC Package Pin Circuit for Multi-State Operation With Fewer Pins
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Solution Overview
Problem
There is a need to enhance operational flexibility in integrated circuit packages with a reduced pin count, as the industry pressures for smaller package sizes lead to decreased operational capabilities.
Innovation Solution
The system incorporates a pin externally coupled to variable resistors and MOSFETs, along with resistor-capacitor circuits and comparators, forming a voltage divider network that allows for multiple configurations and increased operational states through adjustable resistor values and switch states, enabling interpretation of a single pin as various system states.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package size is reduced, then manufacturing cost and space requirements decrease, but operational flexibility and pin count decrease
Solution Approach 1:
The patent implements multi-functionality by enabling a single package pin to perform multiple operational states through internal circuit configurations. The package pin can operate in different modes (e.g., normal operation, test mode, diagnostic states) by changing the configuration of internal resistors, capacitors, and transistors, allowing one pin to replace what would traditionally require multiple pins, thereby reducing package size while maintaining operational flexibility
Solution Approach 2:
The patent applies dynamics by making the package pin's functionality changeable and adaptable through dynamic reconfiguration of internal circuits. The operational characteristics of the pin can be dynamically altered by switching between different circuit states, enabling the same physical pin to serve different purposes at different times, thus preserving versatility in a reduced package size
2Quantity of substance
If pin count is reduced, then package size decreases, but operational capabilities decrease
Solution Approach 1:
The patent utilizes parameter changes by varying the electrical characteristics (resistance, capacitance, transistor states) of internal components to create multiple distinct operational states from a single pin. By changing these parameters dynamically, the system can interpret different states of the same pin as different signal inputs or control commands, thereby maintaining operational capabilities with fewer physical pins
3Adaptability or versatility
If more operational states are achieved with fewer pins, then package size reduces, but circuit complexity increases
Solution Approach 1:
The patent applies merging by combining multiple functional elements (resistors, capacitors, transistors, comparators) into an integrated internal circuit that works together to create multiple operational states. Rather than using separate circuits for each function, the patent merges these components into a coordinated system that can be controlled through a single pin, reducing the number of external connections while managing internal complexity through integration
Data Source
AI summary
In examples, an integrated circuit package comprises a pin exposed externally to the package; at least one resistor coupled to the pin at a first end of the resistor; a first transistor coupled to the at least one resistor at a second end of the resistor and coupled to a voltage source; a second transistor coupled to the at least one resistor at the second end of the resistor and coupled to a ground connection, the at least one resistor and the first and second transistors couple at a first node, the first and second transistors are of different types; and multiple comparators, each of the multiple comparators coupled to a voltage divider network and to the pin.