IC Package Transceiver Interface With Direct Optical Conversion
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Solution Overview
Problem
Conventional transceivers are not adaptable for direct connection to IC packages due to size limitations and require additional hardware for mechanical retention, leading to increased power consumption, bit error rates, and higher costs, while also complicating component placement and testing.
Innovation Solution
A transceiver design that can be plugged directly into an IC package, featuring a zero-insertion-force connector and a heatsink for mechanical retention, allowing electrical signals to be transmitted directly through the IC circuit board without going through the IC package, and enabling separate handling and testing of the transceiver and IC package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transceivers are used with lengthy copper connections through IC package and PCB, then electrical signals can be transmitted, but power consumption increases and bit error rate increases
Solution Approach 1:
The system is divided into two separate connectable units: an IC package and a transceiver. The electrical connection path is segmented so that high-speed electrical signals travel only through the short IC package internal traces rather than the lengthy PCB path, while optical connections handle the external communication. This segmentation reduces signal degradation and power consumption.
Solution Approach 2:
The optical engine is extracted from the conventional transceiver design and integrated directly with the IC package. This allows the electrical-to-optical conversion to occur at the IC package location, eliminating the need for lengthy copper traces to carry high-speed electrical signals across the PCB, thereby reducing power consumption and bit error rates.
2Stability of the object's composition
If conventional transceivers are used with additional hardware for mechanical retention, then mechanical stability is achieved, but device complexity and cost increase
Solution Approach 1:
The mechanical retention function is merged into the connector design itself. The connector incorporates features such as retention lugs, snap-fit mechanisms, or threaded engagement that provide both electrical connection and mechanical retention in a single integrated component, eliminating the need for separate springs, fasteners, and latching hardware.
Solution Approach 2:
The connector is designed to perform multiple functions simultaneously: establishing electrical contact, providing mechanical retention, and enabling alignment. This multi-functional design reduces the overall number of components needed while achieving stable mechanical connection between the IC package and transceiver.
3Reliability
If conventional transceivers are used with lengthy signal paths through IC package and PCB, then electrical connections are established, but manufacturing cost increases
Solution Approach 1:
The system architecture is segmented to separate the high-speed electrical signal path (confined to the short IC package internal traces) from the external communication path (handled by optical connections). This reduces the number of high-speed electrical connections needed through the PCB, simplifying manufacturing and reducing cost.
Solution Approach 2:
The optical engine is taken out from the traditional transceiver location on the PCB and integrated with the IC package. This extraction eliminates the need for lengthy copper traces and associated high-speed electrical infrastructure across the PCB, reducing manufacturing complexity and cost while maintaining reliable signal transmission.
4Adaptability or versatility
If conventional transceivers are used with separate handling of optical and electrical connections, then functional separation is achieved, but component placement complexity increases
Solution Approach 1:
The optical engine and electrical connections are merged into a single integrated unit at the IC package. The optical engine receives electrical signals from the IC die through short internal traces and performs electrical-to-optical conversion, combining both functions in one location. This eliminates the need for separate placement and routing of optical and electrical components across the PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces power consumption, minimizes bit error rates, lowers costs, and simplifies component placement and testing by eliminating the need for lengthy copper connections and additional hardware, while allowing for easier replacement and re-use of the transceiver.
Implementation Method 1
The transceiver includes an optical engine that provides optical-to-electrical and electrical-to-optical conversion
Implementation Method 2
featuring a zero-insertion-force connector and a heatsink for mechanical retention
Data Source
AI summary
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.