IC Package Pad Structure for Reliable Via Testing
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Solution Overview
Problem
Current semiconductor manufacturing processes for integrated circuit components face challenges in efficient wafer level packaging, particularly in the formation and testing of conductive pads and vias, which affect the reliability and cost-effectiveness of the packaging process.
Innovation Solution
The method involves forming conductive pads with specific structural configurations, including core, buffer, and testing regions, and using conductive vias to connect these pads, along with a passivation layer and seed layer formation, to enhance electrical connectivity and testing reliability while optimizing the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wafer level packaging processes are used, then manufacturing simplicity is maintained, but testing reliability and electrical connectivity are insufficient
Solution Approach 1:
The conductive pad is divided into three distinct regions: core contact region, buffer contact region, and testing region. This segmentation allows each region to serve its specific function optimally - the core region provides reliable electrical connection, the buffer region distributes stress and prevents damage propagation, and the testing region enables comprehensive electrical testing. This directly resolves the contradiction by improving testing reliability through functional separation while managing the inherent structural complexity.
Solution Approach 2:
Different regions of the conductive pad are assigned different geometric configurations and material properties tailored to their specific functions. The core contact region has optimized dimensions for electrical connection, the buffer region has extended geometry for stress distribution, and the testing region has specific patterns for testing accessibility. This local optimization improves testing reliability without requiring uniform complexity across the entire pad structure.
2Reliability
If additional conductive pads and vias are added for testing, then testing reliability improves, but manufacturing cost increases
Solution Approach 1:
The conductive pad structure is designed to serve multiple functions simultaneously: electrical connection, mechanical support, stress distribution, and testing. By integrating the testing region directly into the pad structure rather than adding separate testing components, the design achieves multi-functionality that improves testing reliability while avoiding the cost increase associated with additional discrete components and assembly steps.
Solution Approach 2:
The testing function is merged with the electrical connection function by incorporating the testing region as an integral part of the conductive pad structure. This merging eliminates the need for separate testing components and reduces the number of manufacturing steps, thereby improving testing reliability without proportionally increasing manufacturing cost.
3Reliability
If conductive pads with buffer regions are formed, then stress distribution and connection reliability improve, but manufacturing process complexity increases
Solution Approach 1:
The buffer contact region is designed with extended geometry that proactively distributes mechanical stress before it can concentrate and cause failure. This preliminary stress distribution action prevents connection failures and improves reliability. The buffer region's geometric configuration is optimized during design to achieve stress distribution without requiring complex multi-step formation processes, thus managing the trade-off between reliability improvement and process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability of electrical circuit testing and reduces manufacturing costs by optimizing the structure and connectivity of conductive pads and vias within the semiconductor substrate, leading to more efficient wafer level packaging.
Implementation Method 1
conductive pads with specific structural configurations, including core, buffer, and testing regions, and using conductive vias to connect these pads
Implementation Method 2
conductive pads and vias within the semiconductor substrate
Implementation Method 3
along with a passivation layer and seed layer formation
Data Source
AI summary
An integrated circuit component includes a semiconductor substrate, conductive pads, a passivation layer and conductive vias. The semiconductor substrate has an active surface. The conductive pads are located on the active surface of the semiconductor substrate and electrically connected to the semiconductor substrate, and the conductive pads each have a contact region and a testing region, where in each of the conductive pads, an edge of the contact region is in contact with an edge of the testing region. The passivation layer is located on the semiconductor substrate, where the conductive pads are located between the semiconductor substrate and the passivation layer, and the testing regions and the contact regions of the conductive pads are exposed by the passivation layer. The conductive vias are respectively located on the contact regions of the conductive pads.