IC Package Paddle With Curved Recesses For Lead Density
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Solution Overview
Problem
Conventional integrated circuit packaging technologies face challenges in scalability, lead density, package size reduction, maintaining structural integrity, and preventing paddle detachment during high-temperature surface mounting processes.
Innovation Solution
The development of an integrated circuit packaging system that includes a package paddle with non-horizontal sides and terminals, where the paddle has a lower and upper hole with curved surfaces, and an encapsulation that covers these areas, providing additional surface areas for interlocking and preventing detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional leadframe packaging is used, then manufacturing process is simple, but lead density is limited and package size cannot be reduced further
Solution Approach 1:
The leadframe is segmented into modular components including a body portion with recesses, terminal portions extending from the body, and die attach portions. This segmentation allows for optimized lead density while maintaining manufacturing simplicity through standardized modular assembly processes.
Solution Approach 2:
The leadframe structure utilizes three-dimensional positioning with terminals extending in multiple directions from the body portion. The recesses create vertical depth variations that enable higher lead density without increasing the planar footprint, effectively utilizing the Z-dimension for packaging optimization.
2Area of stationary object
If package size is reduced, then footprint area decreases, but structural integrity and paddle attachment reliability deteriorate
Solution Approach 1:
The recesses in the leadframe body portion feature curved surfaces that conform to the paddle geometry. These curved surfaces provide enhanced surface area for bonding and create mechanical interlocking features that prevent paddle detachment during high-temperature reflow processes, thereby maintaining reliability in compact packages.
Solution Approach 2:
The leadframe employs composite construction with the body portion made of one material and terminal portions made of another material. This composite structure allows optimization of each component for its specific function while maintaining overall structural integrity in reduced-size packages.
3Quantity of substance
If lead density is increased through conventional methods, then lead spacing decreases, but manufacturing scalability is limited
Solution Approach 1:
The leadframe body portion serves multiple functions: it provides structural support, contains recesses for paddle attachment, and acts as an electrical interconnect. This multi-functionality reduces the number of separate components needed, enabling higher lead density while maintaining manufacturing scalability through simplified assembly processes.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.