Integrated Circuit Package With Paddle Hole for Low Profile
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Solution Overview
Problem
Current integrated circuit package systems face challenges in achieving low cost manufacturing, improved yield, and low profile while integrating various types of integrated circuits with different interfaces into a single package, as existing technologies do not effectively reduce package dimensions or costs while increasing functionality.
Innovation Solution
The solution involves forming a paddle with a hole and an external interconnect, mounting an integrated circuit device with its active side facing the paddle, connecting internal interconnects through the hole to external interconnects, and encapsulating the device and interconnects with the external interconnects partially exposed, which minimizes package height and reduces the risk of inadvertent shorts during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional multi-chip modules are used with separate IC chips attached to a PCB substrate, then functionality and circuit density are improved, but package size and height increase
Solution Approach 1:
The patent merges multiple IC chips and the PCB substrate into a single integrated package structure. The lead frame paddle serves as both the substrate and packaging structure, with IC chips mounted directly on it and encapsulated together, eliminating the need for separate PCB assembly and reducing overall package size while maintaining multi-chip functionality.
Solution Approach 2:
The patent implements a nested structure where IC chips are mounted on the lead frame paddle, which is then encapsulated within a molding compound. The paddle with hole provides a nested pathway for wire bonds to connect chips, creating a compact hierarchical arrangement that reduces package volume while accommodating multiple components.
2Productivity
If IC chips are stacked vertically within a module to reduce board size, then effective density is improved, but manufacturing complexity and risk of shorts increase
Solution Approach 1:
The patent segments the wire bond routing path by creating a hole through the lead frame paddle. This segmentation allows wire bonds to pass through the paddle in a controlled manner, reducing the risk of shorts between stacked chips while maintaining vertical stacking for high density. The hole creates distinct routing zones that simplify manufacturing control.
Solution Approach 2:
The lead frame paddle with hole acts as an intermediary structure that facilitates vertical chip stacking. The hole provides a guided pathway for wire bonds, mediating the connection between stacked chips and reducing manufacturing complexity by providing a predefined routing path that prevents random wire entanglement and shorts.
3Manufacturing precision
If wire height is reduced to minimize package profile, then manufacturing precision is improved, but the risk of inadvertent shorts during molding increases
Solution Approach 1:
The patent segments the wire bond routing into distinct sections: wires extend from chips to the paddle, pass through the hole in a controlled manner, and then connect to external interconnects. This segmentation allows precise control of wire height in different zones while the hole provides a protected pathway that reduces short risk during molding.
Solution Approach 2:
The patent extracts the wire bond routing path from the bulk material and creates a dedicated hole through the lead frame paddle. This extraction provides a clear, protected pathway for wires that minimizes contact with molding compound and other components, reducing the risk of inadvertent shorts while maintaining low wire height for precise manufacturing.
4Adaptability or versatility
If various IC devices with different interfaces are integrated into a single package, then adaptability is improved, but device complexity and interconnection difficulty increase
Solution Approach 1:
The lead frame paddle serves multiple functions: it acts as the substrate for mounting various IC chips, provides the structural framework for the package, offers electrical interconnection through external interconnects, and creates routing pathways through its hole. This multi-functionality accommodates different IC interfaces and types within a single universal package structure, reducing interconnection complexity.
Solution Approach 2:
The lead frame paddle with hole acts as an intermediary structure that standardizes the interface between different IC chips and the external world. The external interconnects on the paddle provide a common connection point for various chip types, mediating their interconnections and simplifying the integration of diverse devices with different interfaces into a single package.
Data Source
AI summary
An integrated circuit package system comprising: forming a paddle having a hole and an external interconnect; mounting an integrated circuit device having an active side to the paddle with the active side facing the paddle and the hole; connecting a first internal interconnect between the active side and the external interconnect through the hole; and encapsulating the integrated circuit device, the paddle, the first internal interconnect, and the external interconnect with the external interconnect partially exposed.