IC Package Partitioning for Voltage Reference Stability
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Solution Overview
Problem
Precision voltage references in electronic circuits face challenges in maintaining accuracy due to environmental factors like temperature and mechanical stress, which introduce thermal hysteresis, voltage shifts, and long-term aging, requiring costly compensation circuits and external heating to regulate temperature.
Innovation Solution
The integration circuit package partitions circuit components based on environmental sensitivity, with environmentally sensitive circuits on a smaller die isolated from mechanical stress using elastomeric material or a void, and temperature control circuitry to maintain a predetermined temperature, while insensitive circuits are on a larger die, reducing power consumption and integrating temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precision voltage references are used to maintain accuracy over temperature ranges, then voltage reference stability is improved, but power consumption increases due to external heating requirements
Solution Approach 1:
The patent divides the voltage reference system into two separate dies: a first die containing temperature-insensitive circuits and a second die containing the temperature-sensitive voltage reference circuit. This segmentation allows the sensitive circuit to be isolated and thermally regulated independently, reducing the power required for temperature control compared to heating a larger external oven.
Solution Approach 2:
The second die containing the voltage reference circuit is placed within a cavity formed in the first die. This nesting arrangement allows the sensitive circuit to be housed within the larger package structure while maintaining thermal isolation, enabling more efficient temperature control with lower power consumption.
2Temperature
If external heating is used to regulate temperature of voltage references, then temperature stability is improved, but device complexity increases
Solution Approach 1:
The patent combines the temperature control function directly with the voltage reference circuit by integrating temperature control circuitry on the same second die. This merging eliminates the need for separate external compensation circuits and ovens, reducing overall device complexity while maintaining temperature stability.
Solution Approach 2:
The voltage reference die includes self-contained temperature control circuitry that automatically regulates its own temperature without requiring external heating equipment. This self-service approach simplifies the overall system by eliminating external temperature regulation equipment.
3Ease of manufacture
If voltage reference circuits are integrated with other circuits on the same die, then manufacturing simplicity is improved, but environmental sensitivity increases due to mechanical stress
Solution Approach 1:
The patent segments the integrated circuit into two separate dies to isolate the voltage reference circuit from mechanically sensitive components. The first die contains temperature-insensitive circuits that can tolerate mechanical stress, while the second die contains the sensitive voltage reference circuit in a protected cavity, achieving both integration and stress protection.
Solution Approach 2:
The patent applies different structural qualities to different parts of the device: the first die has a solid structure suitable for robust circuits, while the second die is placed in a cavity with elastomeric material providing localized mechanical protection for the sensitive voltage reference circuit. This local differentiation allows integration while protecting sensitive areas.
4Object-affected harmful factors
If voltage reference circuits are isolated from other circuits, then environmental sensitivity is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent nests the second die containing the voltage reference circuit within a cavity of the first die. This nesting provides physical isolation from environmental stresses while maintaining a compact integrated structure, avoiding the need for separate packaging that would increase manufacturing complexity.
Solution Approach 2:
The patent uses composite materials including elastomeric material filling the cavity around the second die. This elastomeric material provides mechanical isolation and environmental protection while being compatible with standard semiconductor packaging processes, balancing isolation benefits with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the stability and accuracy of voltage references by isolating sensitive components from environmental stresses, reducing power requirements, and minimizing thermal Seebeck errors, thus improving the overall performance and efficiency of precision voltage references.
Implementation Method 1
The elastomeric material covers the second die
Implementation Method 2
The molding compound encases the first die, the second die, and the elastomeric material
Implementation Method 3
temperature control circuitry configured to control a temperature of the voltage reference circuit by heating the first die to a predetermined temperature
Implementation Method 4
The plurality of bond wires electrically connect the first die to the second die
Data Source
AI summary
An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.