Thermally Conductive Pillar in IC Package Molding Compound
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Solution Overview
Problem
Integrated circuit (IC) packages with molding compounds face challenges in heat transfer, leading to elevated operating temperatures due to the barrier effect of these compounds, which impedes thermal dissipation from the IC structure to the packaging lid.
Innovation Solution
Incorporating thermally conductive pillars that extend through the molding compound, these pillars are electrically isolated from the stack of dies and metal contacts, allowing them to laterally abut and contact the molding compound, thereby providing a thermal pathway for heat dissipation without interfering with electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is used to protect and encapsulate the IC structure, then physical and chemical protection is provided, but heat transfer is impeded leading to elevated operating temperatures
Solution Approach 1:
The patent divides the molding compound into two functional regions: an electrically insulating molding compound that provides physical protection, and a thermally conductive molding compound that facilitates heat transfer. This segmentation allows each region to perform its specific function without interfering with the other, resolving the contradiction between protection and heat dissipation.
Solution Approach 2:
The patent applies different material properties to different locations within the molding compound. The region adjacent to the IC structure uses a thermally conductive molding compound to facilitate heat transfer, while other regions use electrically insulating material for protection. This local differentiation of material properties allows simultaneous achievement of protection and thermal management.
2Temperature
If thermally conductive pillar is added to improve heat transfer, then operating temperature is reduced, but device complexity increases
Solution Approach 1:
The patent merges the thermal management function with the existing molding compound by making the molding compound itself thermally conductive in specific regions. This eliminates the need for separate thermally conductive pillars or additional heat dissipation structures, thereby reducing device complexity while still achieving improved heat transfer and lower operating temperatures.
Solution Approach 2:
The molding compound is given multiple functions: it provides physical protection, chemical protection, electrical insulation, and thermal conduction. By making the molding compound multi-functional, the patent eliminates the need for separate dedicated components for each function, thereby reducing overall device complexity while achieving the desired thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of thermally conductive pillars effectively reduces the operating temperature of IC packages by facilitating heat transfer from the IC structure to the environment, maintaining temperatures below threshold limits while maintaining electrical isolation and structural integrity.
Implementation Method 1
a thermally conductive pillar extending through the molding compound from the first die to an upper surface of the molding compound
Data Source
AI summary
Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.