IC Package Post with Inward Protrusion for Bond Wire Anchoring
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Solution Overview
Problem
The challenge lies in creating integrated circuit packaging systems that can accommodate increasing electrical connections while minimizing size, ensuring precision in spacing, and maintaining reliability, as existing solutions fail to effectively address the need for higher density and performance in smaller packages.
Innovation Solution
The method involves forming posts with multiple plating layers having a base end with an inward protrusion and a connect riser, positioning an integrated circuit device, attaching a bond wire directly to the protrusion, and encapsulating the device and wire, with the encapsulation exposing portions of the post ends to provide superior pull-out resistance and optimized interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package size is reduced to meet market demand for smaller products, then product size decreases, but the number of electrical connections must increase which creates spacing challenges
Solution Approach 1:
The patent transitions from planar interconnect layouts to three-dimensional vertical posts with inward protrusions. This dimensional change allows multiple electrical connections to be stacked vertically rather than spread horizontally, enabling increased connection density within a reduced package footprint while maintaining adequate spacing between connections.
Solution Approach 2:
The inward protrusion structure creates a nested configuration where the protrusion extends into the encapsulation material, providing mechanical anchoring and electrical connection within a compact volume. This nested design allows the interconnect to occupy minimal space while maintaining structural integrity and electrical functionality.
2Quantity of substance
If more package connectors are added to support increasing electrical connections, then electrical connection capacity increases, but device complexity increases
Solution Approach 1:
The vertical post structure with inward protrusion serves multiple functions simultaneously: it provides mechanical support, establishes electrical connection, enables thermal management pathways, and facilitates precise alignment during assembly. This multi-functional design allows increased connection capacity without proportionally increasing structural complexity.
Solution Approach 2:
The patent combines the interconnect structure with the encapsulation material by having the inward protrusion extend into the encapsulation. This merging of functions allows the encapsulation to serve both as protective housing and as part of the mechanical-electrical connection system, reducing the need for separate components.
3Speed
If bond wire is attached directly to inward protrusion, then wiring length is minimized for improved signal performance, but manufacturing precision requirements increase
Solution Approach 1:
The inward protrusion is pre-formed during the plating process before bond wire attachment. This preliminary formation of the attachment point provides a predetermined, precisely located target for bond wire placement, reducing the actual precision requirements during the wire bonding step while maintaining short wire lengths for optimal signal performance.
Solution Approach 2:
The inward protrusion acts as an intermediary structure between the vertical post and the bond wire. It provides a mechanically robust and electrically conductive attachment point that simplifies the bond wire connection process while maintaining the electrical performance benefits of minimal wiring length.
4Strength
If multiple plating layers are used to form posts, then pull-out resistance is improved, but manufacturing process complexity increases
Solution Approach 1:
The vertical post is constructed from multiple plating layers of different materials (e.g., copper, nickel, palladium, gold) deposited in sequence. This composite structure provides enhanced mechanical strength and pull-out resistance through the combined properties of different materials, while the sequential plating process is a standard manufacturing technique that manages complexity.
Solution Approach 2:
The multi-layer plating approach changes the material composition parameters of the post structure. By varying material types, layer thicknesses, and deposition sequences, the design optimizes pull-out resistance and electrical properties without requiring fundamentally new manufacturing processes, leveraging established electroplating techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in enhanced reliability, optimized interconnects for maximum inputs/outputs, minimized wiring lengths for improved signal performance, and reduced defect rates, supporting the integration of more complex circuitry in compact packages.
Implementation Method 1
forming a post of multiple plating layers having a base end with an inward protrusion, a connect riser, and a top end opposite the base end
Implementation Method 2
attaching a bond wire directly on the inward protrusion and the integrated circuit device
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a post of multiple plating layers having a base end with an inward protrusion, a connect riser, and a top end opposite the base end; positioning an integrated circuit device having a perimeter end facing the connect riser and the inward protrusion; attaching a bond wire directly on the inward protrusion and the integrated circuit device; and applying an encapsulation over the integrated circuit device, the bond wire, the inward protrusion, and around the post, the encapsulation exposing a portion of the base end and the top end of the post.