IC Package Back-Side Power Structure for Lower Resistance
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Solution Overview
Problem
Existing IC packages face challenges with high power distribution path resistance and limited arrangement flexibility due to the lack of direct electrical connections between the back sides of multiple dies.
Innovation Solution
Incorporating a power distribution structure that is electrically connected to the back side power distribution structures of each die, allowing for lower resistance and greater flexibility in die arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional IC package structures are used without direct back-side connections, then manufacturing is simpler, but power distribution path resistance is high
Solution Approach 1:
The patent transitions from traditional front-side-only power distribution to a three-dimensional architecture that utilizes the back side of the substrate for power distribution. By creating back-side power distribution structures and establishing vertical connections through the substrate thickness, the invention adds a new dimensional pathway for power delivery, thereby reducing resistance without simply expanding the planar layout.
Solution Approach 2:
The patent introduces intermediary elements including through-substrate vias and back-side power distribution structures that act as mediators between power sources and load components. These intermediary structures enable indirect power pathways that bypass the limitations of traditional front-side routing, effectively reducing overall power distribution resistance.
2Adaptability or versatility
If dies are arranged in fixed configurations, then manufacturing is easier, but arrangement flexibility is limited
Solution Approach 1:
The patent creates a universal back-side power distribution architecture that can serve multiple different die arrangements and configurations. The standardized back-side structures and connection interfaces enable the same substrate design to accommodate various die layouts, orientations, and stacking configurations, thereby providing multi-functionality and design flexibility without requiring separate manufacturing processes for each arrangement.
Solution Approach 2:
The patent divides the power distribution system into independent modular segments including individual back-side power distribution structures, through-substrate via arrays, and separate die attachment regions. This segmentation allows dies to be independently positioned and configured while each module maintains its manufacturing simplicity, enabling flexible arrangements without proportionally increasing overall manufacturing complexity.
3Reliability
If power distribution paths are lengthened to reach all dies, then all components are powered, but resistance increases
Solution Approach 1:
The patent reduces power distribution path length by utilizing the vertical dimension through the substrate thickness. Instead of routing power laterally across the substrate surface, the invention establishes direct vertical pathways through through-substrate vias and back-side power distribution structures, dramatically shortening the current path and reducing both resistance and associated energy losses.
Solution Approach 2:
The patent introduces back-side power distribution structures as intermediary nodes that receive power closer to the load components. These intermediaries act as local power sources that reduce the distance power must travel through high-resistance paths, thereby minimizing I²R losses while still delivering power to all connected dies.
Data Source
AI summary
An integrated circuit (IC) package includes a first die including first IC devices electrically connected to a first signal routing structure positioned at a first surface and a second surface opposite the first surface, wherein the first die has a first orientation of the first and second surfaces along a first direction, a second die comprising including second IC devices electrically connected to a second signal routing structure positioned at a third surface and a fourth surface opposite the first surface, wherein the second die has a second orientation of the third and fourth surfaces along the first direction opposite the first orientation, and a power distribution structure extending between the second and fourth surfaces and electrically connected to each of the first and second IC devices.