IC Package Power Delivery Substrate for Low-Interference Routing
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Solution Overview
Problem
Existing integrated circuit (IC) package devices face limitations in power delivery due to high manufacturing costs and increased interference from power delivery circuitries, which restrict the density and performance of accelerator devices like GPUs, leading to higher manufacturing complexity and reduced space efficiency.
Innovation Solution
The use of a secondary substrate mounted to a primary substrate, with power delivery circuitries on the secondary substrate and decoupling capacitors, reduces power path resistance and interference, allowing for a more efficient power delivery system with reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power delivery circuitries are integrated on the same substrate as IC devices, then power delivery is provided, but manufacturing costs increase and interference occurs
Solution Approach 1:
The patent divides the substrate into two separate substrates: a first substrate for mounting IC devices and support circuitry, and a second substrate for mounting power delivery circuitries. This segmentation isolates power delivery functions from signal processing functions, reducing interference and manufacturing complexity while maintaining reliable power delivery.
2Productivity
If high density interconnect is used, then wiring density increases, but space for power delivery circuitries decreases
Solution Approach 1:
The patent moves power delivery circuitries from the same two-dimensional plane as IC devices to a separate second substrate. This dimensional separation provides adequate space for power delivery circuitries without compromising the high wiring density achieved through high density interconnect on the first substrate.
3Power
If power delivery circuitries are placed closer to IC devices, then power delivery efficiency improves, but interference with data signals increases
Solution Approach 1:
The patent introduces a second substrate as an intermediary between IC devices and power delivery circuitries. This intermediary maintains efficient power delivery through controlled impedance traces while physically separating power circuitries from data signal paths, thereby reducing electromagnetic interference with data signals.
4Reliability
If decoupling capacitors are added to reduce interference, then signal integrity improves, but manufacturing complexity increases
Solution Approach 1:
The patent combines decoupling capacitors with the second substrate's power delivery circuitries, integrating them into a unified power delivery module. This merging approach improves signal integrity by placing capacitors close to power consumption points while avoiding the need for separate capacitor mounting processes that would increase manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances power density, reduces manufacturing costs, and improves signal integrity by minimizing interference, enabling smaller, denser accelerator devices with increased capacity in computing systems.
Implementation Method 1
The second substrate includes a decoupling capacitor
Data Source
AI summary
A integrated circuit (IC) package device includes a first substrate, an IC device mounted to a first surface of the first substrate, a second substrate, and first power delivery circuitry. The second substrate is mounted to a second surface of the first substrate. The first surface is opposite the second surface. The second substrate includes a decoupling capacitor. The first power delivery circuitry is mounted to the second substrate and coupled to the IC device through the second substrate and the first substrate.