Lead Frame Removal for Reduced IC Package Profile
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost-effectiveness, particularly in portable devices where there is a need for increased packaging density, reduced size, and improved performance.
Innovation Solution
The method involves creating an integrated circuit packaging system with an elevated paddle and base pads, where the lead frame is removed to expose the encapsulation recess and base pad, eliminating the need for a rigid substrate, thus reducing the package profile and enhancing reliability and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid substrate is used to support the integrated circuit, then structural stability is improved, but package profile size increases
Solution Approach 1:
The patent removes the rigid substrate from the package structure, extracting only the essential support functions. The lead frame is eliminated and replaced with an encapsulation structure that provides both support and protection without requiring a separate rigid substrate, thereby reducing package profile while maintaining structural stability.
Solution Approach 2:
The patent merges the support function previously provided by the rigid substrate with the encapsulation structure. The encapsulation now serves dual purposes: protecting the integrated circuit and providing structural support, eliminating the need for a separate substrate and reducing overall package size.
2Quantity of substance
If multiple integrated circuit dice are stacked to increase packaging density, then packaging density is improved, but reliability deteriorates
Solution Approach 1:
The patent transitions from vertical stacking (multiple dice stacked) to a planar arrangement with an elevated paddle structure. This dimensional change allows for increased packaging density through optimized surface area utilization while maintaining reliability by avoiding the complexity and potential failure points associated with vertical stacking and inter-die connections.
3Ease of manufacture
If the lead frame is retained in the package structure, then manufacturing simplicity is maintained, but package profile increases
Solution Approach 1:
The patent extracts and removes the lead frame from the package structure. The lead frame is completely eliminated and its functions are redistributed to other components: the elevated paddle provides mechanical support, the encapsulation provides protection and structural integrity, and wire bonds provide electrical connections, achieving reduced package profile without significantly complicating manufacturing.
4Adaptability or versatility
If wire bonds are used for electrical connections, then connectivity is achieved, but inductance increases affecting high-frequency performance
Solution Approach 1:
The patent segments the electrical connection path into multiple shorter segments through the elevated paddle structure. Instead of long wire bonds spanning the entire package, connections are made at multiple points along the elevated paddle, reducing the length of each connection segment and thereby reducing overall inductance while maintaining electrical connectivity.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a frame platform and a frame base; forming an elevated paddle on the frame platform and a base pad on the frame base; mounting an integrated circuit over the elevated paddle; forming an encapsulation on the lead frame and over the elevated paddle, the base pad, the integrated circuit, and the internal interconnect; and removing the lead frame to expose an encapsulation recess and an encapsulation base with the base pad exposed along the encapsulation base and the elevated paddle exposed in the encapsulation recess.