IC Package RDL Routing With Non-Acute Angle Tile Decomposition
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Solution Overview
Problem
Existing RDL routing algorithms face challenges in efficiently routing multiple nets due to underestimating routing resources and constraining solution spaces, leading to reduced solution quality and high time complexity, especially in non-acute angle scenarios.
Innovation Solution
A novel any non-acute angle routing algorithm for redistribution layers in IC packages, utilizing a computer-based method that includes design rule provision, routing graph construction, net order determination, access point adjustment, and tile routing, with capacity estimation and dynamic programming to optimize wirelength and routability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional RDL routing algorithms are used, then routing can be performed, but routing resources are underestimated and solution space is over-constrained, leading to reduced solution quality
Solution Approach 1:
The patent changes the parameter of routing angle constraint from traditional acute angle limitation to non-acute angle allowance, expanding the solution space and improving routing solution quality by enabling more flexible connection paths in the redistribution layers
Solution Approach 2:
The patent segments the routing problem into multiple sub-problems by dividing the redistribution layer into multiple tiles, with each tile handled independently through tile routing, allowing more flexible resource allocation and reducing the over-constraint issue
2Quantity of substance
If multi-layer structures are proposed to improve routing, then routing capacity increases, but finding optimal topology to minimize layers becomes more complex
Solution Approach 1:
The patent segments the multi-layer routing problem by introducing tile-based decomposition, where each tile represents a manageable unit with its own routing graph, transforming the complex global topology optimization into multiple simpler local optimization problems
Solution Approach 2:
The patent adds a new dimension to the routing problem by introducing vertical via connections between layers as a separate routing dimension, allowing signals to route through multiple layers systematically rather than attempting to optimize a single complex 2D topology
3Productivity
If conventional routing algorithms are used, then routing can be completed, but time complexity is high and scalability is poor
Solution Approach 1:
The patent segments the routing computation into independent tile-based sub-problems, where each tile's routing graph is constructed and solved separately, significantly reducing the overall time complexity and improving scalability compared to monolithic routing approaches
Solution Approach 2:
The patent performs preliminary actions by pre-constraining access points to tile boundaries and pre-dividing the redistribution layer into tiles before routing, which simplifies the subsequent routing computation and reduces time complexity
Data Source
AI summary
A method for routing of redistribution layers in IC package is proposed, which is executed by a computer, the method comprising using the computer to perform the following: providing design rules, a set of I/O pads and bump pads and a pre-assignment netlist; performing a global routing which generates the guides for any non-acute angle RDL routing; and performing a detailed routing which adjusts the access point for shorter wirelength and finishes the routing. After the access points are located, the nets tile by tile are routed.