IC Package Recess for High Density Integration
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Solution Overview
Problem
The challenge lies in developing an integrated circuit package system that achieves low cost manufacturing, improved yield, and increased integration while addressing the need for miniaturization and thinner profiles in high-volume production, particularly in portable devices, where conventional semiconductor packages face obstacles in delivering these requirements effectively.
Innovation Solution
The solution involves forming an external interconnect, connecting an integrated circuit die to it, and creating a package encapsulation with a recess that exposes a portion of the interconnect, allowing for the connection of another integrated circuit device within the recess, which enhances integration density and functionality without impeding external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional semiconductor packages are made smaller and thinner to increase packaging density, then packaging density increases, but manufacturing complexity and difficulty increase
Solution Approach 1:
The package is divided into distinct functional regions: a recess area for mounting additional IC devices and a leadless area for mounting the semiconductor die. This segmentation allows independent optimization of each region, simplifying the manufacturing process while achieving high packaging density through systematic arrangement of components.
2Adaptability or versatility
If more functions and integrated circuits are packed into QFP packages to increase integration, then integration increases, but manufacturing obstacles and difficulty increase
Solution Approach 1:
Multiple IC devices are integrated within a single package structure by mounting them in the recess area alongside the main semiconductor die. This merging of multiple functional components into one package achieves high integration while the standardized lead frame and molding processes maintain manufacturing ease through established fabrication techniques.
3Length of stationary object
If package profile is reduced to achieve thinner packages, then package thickness decreases, but manufacturing precision requirements increase
Solution Approach 1:
The recess is formed on the top surface of the package body, utilizing the vertical dimension to accommodate additional IC devices without increasing the overall package footprint. This dimensional approach allows thin package profiles while maintaining the capability to integrate multiple components through vertical stacking in the recess area.
Data Source
AI summary
An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.