IC Package Recess Structure for Lower Z-Height Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing packaged integrated circuit (IC) devices face limitations in reducing their z-height profile, which restricts further miniaturization and efficiency in space utilization, especially in mobile and ultrabook technologies where multiple components need to be integrated into a single package.
Innovation Solution
The implementation of a recess structure within the packaged device that allows for a multi-level arrangement of substrate structures, enabling one or more IC dies to be suspended partially under the device, thereby reducing the overall z-height by accommodating additional components without increasing the package's dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging structures are used to accommodate multiple IC components, then the package can provide adequate space for components, but the z-height profile increases and cannot be reduced further
Solution Approach 1:
The patent transitions from a conventional planar substrate arrangement to a three-dimensional structure by forming a recess into the substrate. This recess creates an additional vertical dimension for component placement, allowing IC components to be positioned below the main substrate plane. The recess structure with its bottom surface and sidewalls defines a new spatial zone that utilizes the z-dimension efficiently, thereby reducing the overall package height while accommodating multiple components.
Solution Approach 2:
The patent implements a nested arrangement where IC components are positioned within the recess structure formed in the substrate. The recess acts as a container that holds the IC component, similar to a nested doll configuration. This nesting approach allows the IC component to be embedded within the substrate structure rather than placed on its surface, optimizing space utilization and reducing the package's external dimensions.
2Device complexity
If components are arranged in a single plane on the substrate, then the package structure remains simple, but the space utilization efficiency is limited
Solution Approach 1:
The patent introduces a vertical dimension by forming a recess into the substrate, transforming the component arrangement from a two-dimensional planar layout to a three-dimensional configuration. The recess creates a lower level where additional components can be placed, effectively utilizing the z-dimension. This multi-level arrangement significantly improves space utilization efficiency without requiring a proportional increase in structural complexity.
Solution Approach 2:
The patent segments the substrate into different levels by forming a recess, creating distinct spatial zones: an upper level (substrate surface) and a lower level (recess interior). This segmentation allows different IC components to be positioned at different vertical levels, enabling more efficient packing of multiple components within the same footprint while maintaining a manageable structural complexity through modular design.
Data Source
AI summary
A packaged device (110) includes a substrate (114) and one or more contacts (118) disposed on a side of the substrate (114). Structures of the packaged device (110) define at least in part a recess region (120) that extends from the side of the substrate (114) and through the substrate (114), where one or more contacts (124) of a second hardware interface are disposed in the recess region (120). The one or more contacts (118) of the first hardware interface enable connection of the packaged device (110) to a printed circuit board. The one or more contacts (124) of the second hardware interface enable connection between one or more IC dies of the packaged device (110) and another IC die (150) that is a component of the packaged device (110) or of a different packaged device.