Integrated Circuit Package System with Redistribution Film
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Solution Overview
Problem
Existing integrated circuit package technologies face challenges in reducing size, cost, and manufacturing time due to the need for additional substrate materials, which increase thickness and complexity, failing to meet demands for smaller, faster, and more reliable devices.
Innovation Solution
A method involving a base device with a base interconnect and encapsulant, topped with a re-routing film for connectivity, eliminating the need for a substrate, thereby reducing package thickness and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a substrate is used for connecting base device and interconnect, then structural support and connectivity are provided, but package thickness and manufacturing complexity increase
Solution Approach 1:
The patent extracts and removes the substrate from the traditional package structure, retaining only the essential base device and interconnect elements. This elimination of the substrate directly reduces package thickness while simplifying the manufacturing process by removing substrate-related fabrication steps.
Solution Approach 2:
The patent employs thin film structures to replace the bulky substrate, using deposited film layers to provide the necessary structural support and electrical connectivity. This approach maintains functional requirements while dramatically reducing the vertical dimension of the package.
2Reliability
If additional substrate material is used, then structural integrity is maintained, but manufacturing cost and cycle time increase
Solution Approach 1:
The patent merges the structural support function and electrical connectivity function into a single integrated structure formed by depositing film layers. This consolidation eliminates the need for separate substrate material while maintaining both structural integrity and electrical pathways, thereby reducing manufacturing steps and cycle time.
Solution Approach 2:
The patent changes the physical state and form of the support structure from bulk substrate material to thin deposited films. This parameter change from thick to thin structures reduces material quantity and manufacturing complexity while preserving the essential structural and functional properties.
3Ease of manufacture
If conventional packaging technology is used, then manufacturing processes are proven, but package size reduction is limited
Solution Approach 1:
The patent replaces the mechanical substrate-based packaging approach with a film deposition-based construction method. This substitution enables greater miniaturization by building the package structure layer-by-layer with thin films rather than relying on the minimum thickness constraints of conventional substrates.
Data Source
AI summary
A method for manufacturing an integrated circuit package system includes: providing a base device; attaching a base interconnect to the base device; applying an encapsulant over the base device and the base interconnect; and forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.