IC Package Carrier with Release Layer for Mixed Pad Structures

Solution Overview

Problem

The semiconductor industry faces challenges in packaging integrated circuit dies with different contact pad structures into a single package, which complicates manufacturing and increases costs due to the need for complex process steps and potential damage to contact pads during encapsulation.

Innovation Solution

A method involving a carrier with a release layer and adhesive layer is used to attach IC dies with varying contact pad structures, followed by encapsulation and redistribution layers to ensure electrical contact without covering the pads, allowing for the formation of stacked IC packages that can be easily detached and diced into individual units without damaging the contact pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If complex process steps are used to package IC dies with different contact pad structures, then packaging flexibility is improved, but manufacturing cost increases

Engineering Contradiction:

Improvepackaging flexibilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent implements a universal packaging process that can handle multiple types of contact pad structures (e.g., bump pads, wire bond pads, flip chip pads) using the same encapsulation methodology. The mold compound formulation and application process are designed to be compatible with various pad types without requiring separate specialized processes, thereby achieving packaging flexibility while maintaining cost-effectiveness through process standardization.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If complex process steps are used to package IC dies with different contact pad structures, then packaging flexibility is improved, but process complexity increases

Engineering Contradiction:

Improvepackaging flexibilityVSAvoidprocess complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal packaging process that can handle multiple types of contact pad structures (e.g., bump pads, wire bond pads, flip chip pads) using the same encapsulation methodology. The mold compound formulation and application process are designed to be compatible with various pad types without requiring separate specialized processes, thereby achieving packaging flexibility while maintaining cost-effectiveness through process standardization.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If conventional encapsulation methods are used, then manufacturing simplicity is maintained, but contact pads may be damaged during encapsulation

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidcontact pad integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent modifies the physical and chemical parameters of the mold compound to achieve optimal encapsulation. The compound is formulated with specific viscosity, curing characteristics, and mechanical properties that allow it to flow around and protect contact pads without causing damage during the encapsulation process. The curing parameters (temperature, time, pressure) are also optimized to ensure gentle yet effective encapsulation that preserves pad integrity.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS10125014B2Integrated circuit package and method of forming same

Publication Date: 2018.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Integrated circuit packages and methods of forming same are provided. A method includes attaching a first die and a second die to a carrier, the first die having a first contact pad, the second die having a second contact pad, the first contact pad and the second contact pad having different structures. A release layer is formed over the first die and the second die. An encapsulant is injected between the carrier and the release layer. One or more redistribution layers (RDLs) are formed over the first die, the second die and the encapsulant, the first contact pad and the second contact pad being in electrical contact with the one or more RDLs.