IC Package Connector Layout to Withstand Resin Thermal Stress
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Solution Overview
Problem
The reliability of electrical connections in electronic devices is compromised due to stress applied by the deformation of reinforcing resin caused by temperature changes, which affects the connection between IC packages.
Innovation Solution
The electronic device incorporates a reinforcing member made of resin that contacts the IC packages, with electrical connectors positioned to avoid direct stress application by being dislocated from the resin's facing portion, thereby maintaining connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If reinforcing resin is used to ensure electrical connection reliability between IC packages, then connection strength is improved, but stress is applied to electrical connectors due to resin deformation from temperature changes
Solution Approach 1:
The patent extracts the harmful portion of the electrical connector (the section that would be subjected to stress) from the stress zone by dislocating it from the member facing portion of the reinforcing resin. This separates the electrical connection function from the stress-prone area, allowing the connector to maintain reliability while the resin provides reinforcement.
Solution Approach 2:
The patent introduces an intermediary spatial arrangement where the electrical connector's signal transmission path is routed away from the reinforcing resin's facing portion. This intermediary positioning allows the resin to perform its reinforcement function without directly transmitting stress to the electrical connection points.
2Reliability
If electrical connectors are positioned to avoid stress from reinforcing resin, then electrical connection reliability is improved, but device complexity increases due to dislocated positioning
Solution Approach 1:
The patent merges the reinforcing resin structure with the electrical connector design by integrating the dislocated connector sections into the overall connector architecture. The connector is designed as a unified structure that inherently accounts for the dislocated positioning, eliminating the need for separate complex positioning mechanisms.
Solution Approach 2:
The patent applies local quality by making different sections of the electrical connector have different positional characteristics. Specific sections are dislocated from the member facing portion while other sections maintain standard positioning, allowing the connector to optimize for both stress avoidance and structural integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration suppresses stress on electrical connectors, preventing connection failures and maintaining reliability between IC packages, even under temperature fluctuations.
Implementation Method 1
stress applied by the deformation of reinforcing resin caused by temperature changes
Data Source
AI summary
An electronic device includes first, second, and third circuit components, a reinforcing member, and electrical connectors. The second circuit component includes a surface on which the first circuit component mounts. The second circuit component is electrically connected to the first circuit component. The reinforcing member is in contact with the first circuit component and the surface of the second circuit component, and reinforces a connection between the first and second circuit components. The third circuit component has a mounting surface on which the second circuit component mounts, and is electrically connected the second circuit component. The electrical connectors include at least one electrical connecting portion establishing an electrical connection between the second circuit component and the third circuit component. At least one section of each of the electrical connectors is outside a member facing portion facing the reinforcing member.


