IC Package Redistribution Sealing Ring for Delamination Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in reducing delamination and peeling during the singulation process, which can lead to defects and reduced reliability of integrated circuit packages.
Innovation Solution
The formation of a sealing ring in a redistribution structure, which is electrically non-functional and surrounds the electrically functional features, helps to stop the spreading of singulation-induced cracks and reduce delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor packaging uses conventional structures without sealing rings, then the manufacturing process is simpler, but delamination and peeling occur during singulation leading to reduced reliability
Solution Approach 1:
The sealing ring is formed in advance during the redistribution structure fabrication process, before the singulation step occurs. This preliminary formation of the crack-arresting feature ensures that when singulation later occurs, the cracks are already contained and cannot propagate through the entire package structure, thereby preventing delamination and peeling.
Solution Approach 2:
The sealing ring acts as an intermediary element within the redistribution structure that mediates between the conflicting requirements of structural integrity and crack propagation. It serves as a physical barrier that intercepts and contains cracks, preventing them from spreading to critical areas, thus protecting the overall package reliability without requiring fundamental changes to the packaging approach.
2Reliability
If a sealing ring is added to the redistribution structure, then crack propagation is stopped and delamination is reduced, but the device complexity increases
Solution Approach 1:
The sealing ring is merged with the existing redistribution structure, forming an integrated component rather than a separate additive element. The sealing ring shares the same substrate and is formed using the same fabrication processes as the functional conductive features, effectively combining the crack-arresting function with the existing structural framework and minimizing additional complexity.
Solution Approach 2:
The sealing ring serves multiple functions: it acts as both a structural component of the redistribution layer and a crack-arresting feature. By making the sealing ring electrically non-functional while structurally integrated, it provides universal utility—serving the dual purpose of maintaining electrical isolation and preventing mechanical failure during singulation, thereby reducing the need for separate protective measures.
3Productivity
If the sealing ring is formed concurrently with functional features, then manufacturing steps are reduced, but the sealing ring must be electrically isolated to prevent interference
Solution Approach 1:
The sealing ring is designed with local electrical non-functionality, meaning it is electrically isolated or discontinuous in specific regions where it contacts or approaches functional conductive features. This localized electrical isolation allows the sealing ring to maintain its crack-arresting function while preventing electrical interference, enabling concurrent formation with functional features without compromising circuit integrity.
Solution Approach 2:
The sealing ring is segmented or discontinuous in its electrical connectivity, with gaps or isolation regions that prevent electrical interference with functional features. This segmentation allows the sealing ring to be formed using the same metallization processes as functional conductors, maintaining manufacturing efficiency while ensuring electrical isolation through strategic discontinuities in the sealing ring's conductive path.
Data Source
AI summary
In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die; and a redistribution structure including: a plurality of dielectric layers over the encapsulant and the integrated circuit die; a plurality of metallization patterns in the dielectric layers, the metallization patterns being electrically coupled to the integrated circuit die; and a sealing ring in the dielectric layers, the sealing ring extending around the metallization patterns, the sealing ring being electrically isolated from the metallization patterns and the integrated circuit die, the sealing ring including a plurality of sealing ring layers, each of the sealing ring layers including a via portion extending through a respective one of the dielectric layers, the via portion of each of the sealing ring layers being aligned along a same common axis.