IC Package Thermoelectric Self-Cooling for 3DIC Heat Dissipation

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Solution Overview

Problem

Existing integrated circuit (IC) structures face challenges with thermal dissipation, bonding, delamination, and reliability issues, particularly in advanced 3DIC stacking with high current, high voltage, or high speed applications, leading to inefficiencies in heat management and performance.

Innovation Solution

Integration of a thermoelectric self-cooling device (TESCD) with a thermoelectric cooling (TEC) device and a liquid cooling module, which includes a generator to generate electrical power for self-cooling, enhancing thermal dissipation and reducing reliance on external power sources.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If 3DIC stacking technology is used to increase integration density, then productivity and functionality are improved, but thermal dissipation becomes more difficult and reliability deteriorates

Engineering Contradiction:

Improveintegration densityVSAvoidthermal dissipation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent transitions from planar heat dissipation to three-dimensional heat management by integrating cooling channels and heat sinks that extend vertically through the stacked IC structure, enabling heat to be dissipated in multiple spatial dimensions rather than relying solely on lateral spreading at the chip surface

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces intermediate thermal management components between the IC chips, including thermal interface materials, heat spreaders, and cooling channels that act as mediators to facilitate heat transfer from the heat-generating chips to the cooling system, improving overall thermal dissipation efficiency

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If 3DIC stacking technology is used to increase integration density, then productivity is improved, but bonding and delamination issues worsen

Engineering Contradiction:

Improveintegration densityVSAvoidbonding and delamination

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent modifies thermal parameters by implementing active cooling systems that maintain optimal temperature ranges during bonding operations and throughout device operation, preventing thermal-induced delamination by keeping temperatures within safe operational parameters for the bonding interfaces

Inventive Principle:

Principle #35Parameter changes

3Temperature

If thermoelectric cooling device is integrated to improve thermal dissipation, then temperature control is improved, but device complexity increases

Engineering Contradiction:

Improvetemperature controlVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates the thermoelectric cooling device with existing IC packaging structures, enabling the same component to serve both as a structural element of the package and as an active thermal management device, thereby reducing overall system complexity despite the advanced cooling functionality

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the thermoelectric cooling device with the IC chip stack and packaging structure into a unified integrated system, merging previously separate functions (cooling, packaging, electrical interconnection) into a single integrated assembly that reduces complexity compared to adding a standalone cooling system

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The TESCD provides efficient heat dissipation and improved performance by utilizing a thermoelectric cooling mechanism with a generator, reducing thermal stress and enhancing reliability in IC structures.

Implementation Method 1

a thermoelectric cooling (TEC) device having a plurality of TEC units configured in an array and electrically connected to provide cooling effect to the IC packaging structure

Methodology Applied

Scientific EffectThermoelectric cooling: Peltier Effect

Implementation Method 2

a generator coupled with the cooling liquid driving device to collectively generate an electrical power supplied to the TEC device

Methodology Applied

Scientific EffectElectromagnetic generation: Electromagnetic Induction

Data Source

PatentUS20250218895A1Integrated Circuit Package Structure with Thermelectric Self-Cooling Device

Publication Date: 2025.07.03 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present disclosure provides an integrated circuit (IC) structure that includes an IC packaging structure having an IC chip; and a thermoelectric self-cooling device (TESCD) integrated with the IC packaging structure. The TESCD further includes a thermoelectric cooling (TEC) device having a plurality of TEC units configured in an array and electrically connected to provide cooling effect to the IC packaging structure, and a liquid cooling module having a cooling liquid driving device and a generator coupled with the cooling liquid driving device to collectively generate an electrical power supplied to the TEC device with self-cooling function to the IC packaging structure.