IC Package Sensor Lateral Exposure Mold Cost

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Integrated circuit sensor packages are costly to produce due to the need for unique mold assemblies for each die configuration, and exposure of sensor elements at the top surface leads to dust accumulation, causing inaccuracies in humidity and gas sensing.

Innovation Solution

The use of elongate members, such as tubular or porous members, that are positioned proximate to the IC die to allow ambient atmosphere contact while being encapsulated, reducing the need for custom mold assemblies and minimizing dust accumulation by exposing the sensor elements through lateral sides or ends of the encapsulant block.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sensor elements are exposed at the top surface of the encapsulant block, then the sensor can contact the ambient atmosphere for sensing, but dust accumulates on the sensor elements causing inaccuracies in humidity and gas sensing

Engineering Contradiction:

Improvesensing accuracyVSAvoiddust accumulation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from vertical exposure (top surface) to lateral exposure through sidewalls. The sensor elements are positioned to contact the ambient atmosphere through lateral openings in the encapsulant block rather than through a top surface opening, thereby preventing dust accumulation while maintaining atmospheric contact capability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If custom mold assemblies are used for each die configuration, then the sensor package can be produced with precise die positioning, but production costs increase

Engineering Contradiction:

Improvedie configuration precisionVSAvoidproduction cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent employs a universal mold assembly that can accommodate multiple die configurations through adjustable positioning mechanisms. The mold assembly includes positioning features that can be reconfigured for different sensor die layouts, eliminating the need for dedicated custom mold assemblies for each die configuration and thereby reducing production costs

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If a single mold assembly is used for various IC package configurations, then production costs are reduced, but manufacturing precision for specific die configurations may be compromised

Engineering Contradiction:

Improveproduction costVSAvoiddie configuration precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The mold assembly incorporates dynamic, adjustable positioning mechanisms that allow reconfiguration for different die configurations. The positioning system can be adjusted during operation to accommodate various sensor die layouts while maintaining precise positioning accuracy, thus achieving both cost reduction through single-mold usage and precision maintenance

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS10077186B2Integrated circuit package with sensor and method of making

Publication Date: 2018.09.18 TEXAS INSTRUMENTS INC

AI summary

An integrated circuit (“IC”) package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.