IC Package Shell Lip and Substrate Thermal Expansion Match
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Solution Overview
Problem
Integrated circuit packaging faces challenges in reducing size while maintaining reliability and heat dissipation due to increasing connector density, requiring innovative solutions for improved performance and cost-effectiveness.
Innovation Solution
The method involves forming an integrated circuit device with a device shell having a shell lip contiguous with the device backside and lateral side, attaching a substrate, and creating an encapsulation that covers the device and shell, utilizing a substrate with a similar coefficient of thermal expansion to prevent delamination and enhance connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of connectors decreases and density increases to reduce package size, then the package size and weight are reduced, but heat dissipation becomes insufficient and reliability deteriorates
Solution Approach 1:
The invention divides the package structure into distinct functional zones: a first portion with higher connector density and a second portion with lower connector density. This segmentation allows optimized heat dissipation in the high-density area while maintaining overall package size reduction, resolving the contradiction between miniaturization and thermal management.
Solution Approach 2:
The invention applies different design characteristics to different regions of the package. The first portion (with higher connector density) receives enhanced heat dissipation features such as increased via density, thermal vias, or copper pours, while the second portion uses standard design. This local quality approach ensures reliable heat dissipation where needed without compromising overall package size.
2Adaptability or versatility
If the connector density increases to improve device functionality, then more connections are achieved, but manufacturing precision requirements increase and costs rise
Solution Approach 1:
The invention segments the connector array into a first portion with higher density and a second portion with lower density. This segmentation allows the high-functionality first portion to be manufactured with enhanced precision controls, while the second portion uses standard manufacturing tolerances, thereby maintaining device functionality without uniformly increasing manufacturing precision requirements across the entire package.
3Volume of moving object
If the package size is reduced to meet portability requirements, then device portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The invention concentrates heat dissipation resources in the first portion of the package where higher connector density generates more heat. This includes placing thermal vias, heat sinks, or copper ground planes specifically in the high-density region, allowing effective heat management in a compact overall package volume.
Solution Approach 2:
The invention addresses heat dissipation in the vertical dimension by implementing multi-layer PCB structures with thermal vias connecting different layers, and by using three-dimensional heat dissipation pathways such as heat pipes or thermal conduction paths extending through the package thickness, thereby improving heat dissipation efficiency without increasing package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability and performance of integrated circuit packaging by preventing delamination and ensuring effective heat dissipation, while maintaining connectivity and reducing costs through a straightforward manufacturing process.
Implementation Method 1
utilizing a substrate with a similar coefficient of thermal expansion to prevent delamination
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming an integrated circuit device having a device contact surface, a device lateral side, and a device backside opposite the device contact surface; forming a device shell, having a shell lip, contiguous with the device backside and the device lateral side, the shell lip adjacent to and coplanar with the device contact surface; attaching a substrate to the integrated circuit device, the device shell between the integrated circuit device and the substrate; and forming an encapsulation on the substrate and covering the integrated circuit device and the device shell.