IC Package Shield Layer for Signal Integrity and Radiation Protection

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Solution Overview

Problem

Advanced integrated circuit packaging technologies face challenges in maintaining signal integrity due to parasitic capacitance and ionizing radiation exposure in miniaturized medical devices, which can lead to signal integrity issues and single event upsets.

Innovation Solution

Incorporating a redistribution layer with conductive traces and shield regions between the integrated circuit and patterned conductive layers to reduce parasitic capacitance and dissipate ionizing radiation, thereby protecting the integrated circuit from interference and radiation-induced errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If miniaturized medical devices are used, then device size is reduced, but signal integrity deteriorates due to parasitic capacitance

Engineering Contradiction:

Improvedevice sizeVSAvoidsignal integrity

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

A shield region is introduced as an intermediary conductive structure between the integrated circuit and patterned conductive layers. This shield acts as a mediator that blocks parasitic capacitance coupling while allowing the miniaturized device structure to be maintained, thus preserving signal integrity without increasing device volume significantly

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If miniaturized medical devices are used, then device size is reduced, but susceptibility to ionizing radiation increases

Engineering Contradiction:

Improvedevice sizeVSAvoidionizing radiation susceptibility

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The shield region serves as a protective intermediary between the integrated circuit and the external environment. It absorbs or blocks ionizing radiation before it reaches the sensitive integrated circuit, thereby reducing radiation susceptibility while maintaining the compact device form factor

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If shield regions are added to reduce parasitic capacitance, then signal integrity is improved, but device complexity increases

Engineering Contradiction:

Improvesignal integrityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The shield region is merged with the redistribution layer structure, combining the functions of signal redistribution and parasitic capacitance shielding into a single integrated layer. This merging approach improves signal integrity while minimizing the increase in device complexity by avoiding separate shield structures

Inventive Principle:

Principle #5Merging (Combining)

4Object-affected harmful factors

If shield regions are added to block ionizing radiation, then radiation protection is improved, but device complexity increases

Engineering Contradiction:

Improveradiation protectionVSAvoidpackage structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The radiation shielding function is merged into the redistribution layer by incorporating conductive shield regions that serve both electrical redistribution and radiation protection purposes. This integration improves radiation protection while keeping the package structure relatively simple by avoiding additional dedicated shielding layers

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively improves signal integrity by reducing parasitic capacitance and mitigates ionizing radiation effects, ensuring reliable operation of miniaturized medical devices by isolating sensitive circuitry from radiation and enhancing electrical signal integrity.

Implementation Method 1

such shield region can be configured to reduce parasitic capacitance between the integrated circuit and the patterned conductive layer

Methodology Applied

Scientific EffectParasitic capacitance: Parasitic Capacitance

Implementation Method 2

such shield region can be configured to dissipate ionizing radiation that is incident upon the shield region, thereby potentially preventing this ionizing radiation from being incident upon the integrated circuit

Methodology Applied

Scientific EffectIonizing radiation: Radiation

Data Source

PatentUS20230420383A1Integrated circuit package and medical device including same

Publication Date: 2023.12.28 MEDTRONIC INC

AI summary

Various embodiments of an integrated circuit package are disclosed. The package includes an integrated circuit having an integrated circuit contact disposed on a first major surface of the integrated circuit; a first passivation layer disposed on the first major surface of the integrated circuit and over the integrated circuit contact; and a redistribution layer disposed on the first passivation layer. The redistribution layer includes a conductive trace and a shield region that define a plane of the redistribution layer. The package further includes a second passivation layer disposed on the redistribution layer, and a patterned conductive layer disposed on the second passivation layer and including a conductive trace. A portion of the shield region of the redistribution layer is disposed between the conductive trace of the patterned conductive layer and the integrated circuit along an axis that is substantially orthogonal to the first major surface of the integrated circuit.