Integrated Circuit Package Shielding via Elevated Tiebar
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Solution Overview
Problem
Integrated circuit packages face challenges with complex processing, poor construction, and insufficient electromagnetic interference (EMI) shielding, leading to increased costs, decreased yield, and unreliable operation due to inadequate shielding coverage.
Innovation Solution
The implementation of an elevated tiebar with a die paddle and an attached shield, where the shield is mounted over the tiebar and die paddle, and encapsulant is formed over the tiebar, paddle, and die, providing improved EMI shielding through a simpler and more robust construction process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional EMI shielding methods are used in integrated circuit packages, then shielding coverage can be achieved, but processing complexity increases and manufacturing yield decreases
Solution Approach 1:
The patent combines the EMI shield with the lead frame structure by forming the shield as an integral part of the lead frame or by attaching it to the lead frame before molding. This merging eliminates separate shielding components and their associated complex assembly processes, thereby reducing processing complexity while maintaining comprehensive EMI shielding coverage.
Solution Approach 2:
The lead frame structure is designed to serve multiple functions: it provides electrical interconnection, mechanical support, and EMI shielding. By making the lead frame multi-functional, the patent eliminates the need for separate dedicated shielding components, simplifying the overall manufacturing process while achieving effective EMI protection.
2Object-affected harmful factors
If traditional EMI shielding methods are used in integrated circuit packages, then shielding coverage can be achieved, but manufacturing yield decreases
Solution Approach 1:
The EMI shield is attached to the lead frame before the die attachment and wire bonding processes. This preliminary action ensures that the shielding structure is already in place and properly positioned before subsequent manufacturing steps, reducing the risk of misalignment, damage, or rework that could decrease manufacturing yield.
Solution Approach 2:
By integrating the shield formation into the lead frame manufacturing process itself, the patent creates a unified structure that is manufactured as a single component. This eliminates multiple separate assembly steps that could introduce defects or variability, thereby improving manufacturing yield while maintaining comprehensive EMI shielding coverage.
3Device complexity
If shield attach methods are simplified, then processing complexity decreases, but shielding effectiveness deteriorates
Solution Approach 1:
The patent merges the shield with the lead frame structure so that they form a unified, integrated component. This integration ensures optimal shielding effectiveness through continuous electrical connection and proper geometric configuration, while the combined structure simplifies the attach process by eliminating separate mounting operations.
Solution Approach 2:
The patent optimizes the electrical and geometric parameters of the integrated shield-lead frame structure, such as conductor thickness, trace routing, and grounding configuration, to achieve maximum shielding effectiveness. By carefully controlling these parameters during the integrated manufacturing process, the patent maintains high shielding performance while keeping the process simple.
4Object-affected harmful factors
If electrical grounding of the shield is improved, then EMI shielding performance increases, but package construction complexity increases
Solution Approach 1:
The patent combines the shield grounding path with the lead frame's existing electrical interconnection structure. By utilizing the lead frame's inherent conductivity and grounding paths, the patent achieves effective EMI shielding grounding without adding separate grounding components or complex grounding networks, thereby maintaining simple package construction while improving shielding performance.
Data Source
AI summary
An integrated circuit package system comprising: providing an elevated tiebar; forming a die paddle connected to the elevated tiebar; attaching an integrated circuit die over the die paddle adjacent the elevated tiebar; attaching a shield over the elevated tiebar and the integrated circuit die; and forming an encapsulant over a portion of the elevated tiebar, the die paddle, and the integrated circuit die.