Integrated Circuit Package Sidewall EMI Shielding
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Solution Overview
Problem
Current integrated fan-out packages face challenges in effectively shielding electromagnetic interference (EMI) while maintaining compactness and efficiency in semiconductor component integration.
Innovation Solution
The process involves forming conductive pillars on semiconductor dies, encapsulating them with a protection material, and then integrating an electromagnetic interference shielding layer that is electrically grounded and covers the sidewalls, which is subsequently encapsulated with an insulating material to protect and shield the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electromagnetic interference shielding layer is conformally formed on the appearance of the package, then EMI shielding is improved, but the compactness and integration density are reduced
Solution Approach 1:
The shielding layer is selectively formed only on the sidewalls of the semiconductor die that are exposed after encapsulation, rather than conformally coating the entire package appearance. This localized approach provides EMI shielding where most needed while minimizing volume consumption.
Solution Approach 2:
The shielding function is integrated into the vertical sidewall structure of the die rather than adding a horizontal conformal layer on the package exterior. This dimensional repositioning maintains compactness by utilizing existing structural space.
2Object-affected harmful factors
If a conformal EMI shielding layer is formed on the package appearance, then EMI shielding is improved, but the manufacturing complexity increases
Solution Approach 1:
The shielding layer is formed on the die sidewalls before the final encapsulation step, when the sidewalls are naturally exposed. This preliminary formation eliminates the need for subsequent complex conformal coating processes on the finished package.
Solution Approach 2:
The encapsulation process itself creates the exposed sidewall structure that the shielding layer needs to cover. The manufacturing process automatically provides the ideal substrate geometry for the shielding layer without requiring additional shaping or preparation steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields EMI, protects the semiconductor components, and maintains the compactness and efficiency of integrated fan-out packages by ensuring the conductive pillars are accessible and the shielding layer is integrated within the package structure.
Implementation Method 1
an electromagnetic interference shielding layer which is conformally formed on the appearance of the packages may be used to shield EMI from environment
Data Source
AI summary
An integrated circuit package including at least one integrated circuit component, at least one electromagnetic interference shielding layer and an insulating encapsulation is provided. The at least one integrated circuit component includes an active surface, a plurality of sidewalls connected to the active surface and a plurality of conductive pillars protruding from the active surface. The at least one electromagnetic interference shielding layer covers the sidewalls of the at least one integrated circuit component, and the at least one electromagnetic interference shielding layer is electrically grounded. The insulating encapsulation encapsulates the at least one integrated circuit component and the at least one electromagnetic interference shielding layer, and the conductive pillars of the at least one integrated circuit component are accessibly exposed by the insulating encapsulation. Methods of fabricating the integrated circuit package are also provided.