IC Package Heat Dissipation Layer for Sidewall Cooling

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Solution Overview

Problem

The challenge of effectively packaging semiconductor dies with improved heat dissipation structures has arisen due to the need for smaller and more creative packaging techniques as integration density increases, necessitating efficient heat management in integrated circuit packages.

Innovation Solution

The formation of heat dissipation structures around the package components after singulation, which allows for larger surface area heat dissipation by being formed on the back-side surfaces and sidewalls of the package components, enhancing thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If heat dissipation structures are formed before singulation, then manufacturing complexity is reduced, but surface area for heat dissipation is limited

Engineering Contradiction:

Improvesurface area for heat dissipationVSAvoidmanufacturing complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent divides the manufacturing process into two stages: first forming heat dissipation structures on the back-side surfaces of package components before singulation, then completing the structures after singulation. This segmentation allows the process to benefit from both reduced manufacturing complexity (by starting before singulation) and increased surface area (by completing after singulation when sidewalls are accessible).

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary formation of heat dissipation structures on the back-side surfaces before singulation, establishing a foundation that will be completed later. This preliminary action reduces manufacturing complexity by doing work while components are still grouped, while the subsequent completion step after singulation maximizes the surface area by accessing all sidewalls.

Inventive Principle:

Principle #10Preliminary action

2Temperature

If heat dissipation structures are formed on sidewalls, then heat dissipation efficiency improves, but risk of shorting conductive connectors increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidrisk of shorting conductive connectors

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies different treatments to different regions: heat dissipation structures are formed on sidewalls in regions away from conductive connectors to maximize heat dissipation, while adhesive layers are applied in regions near conductive connectors to prevent shorting. This local differentiation allows the system to achieve both high heat dissipation efficiency and reliability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent introduces an adhesive layer as an intermediary substance between the heat dissipation structures and conductive connectors. This adhesive layer acts as a barrier that prevents direct contact between conductive elements, eliminating the shorting risk while allowing the heat dissipation structures to function effectively on the sidewalls.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If heat dissipation structures are formed after singulation, then surface area increases, but manufacturing cost increases

Engineering Contradiction:

Improvesurface area for heat dissipationVSAvoidmanufacturing cost

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent segments the heat dissipation structure formation into two phases: a first phase before singulation that covers back-side surfaces, and a second phase after singulation that covers sidewalls. This segmentation allows the process to achieve maximum surface area while controlling manufacturing costs by performing some work in the more efficient pre-singulation phase.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent performs partial formation of heat dissipation structures before singulation (covering back-side surfaces) and completes the remaining portions after singulation (covering sidewalls). This partial action approach balances the competing demands of surface area maximization and manufacturing cost control by doing what can be done efficiently before singulation and completing the rest after.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves heat dissipation in integrated circuit packages by utilizing a larger surface area for heat dissipation structures, reducing manufacturing costs and increasing yield while avoiding shorting of conductive connectors.

Implementation Method 1

a heat dissipation layer on the back-side of the package component and on sidewalls of the package component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250309032A1Heat dissipation structures for integrated circuit packages and methods of forming the same

Publication Date: 2025.10.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In an embodiment, a device includes: a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component, the integrated circuit die exposed at a back-side of the package component; a heat dissipation layer on the back-side of the package component and on sidewalls of the package component; an adhesive layer on a back-side of the heat dissipation layer, a portion of a sidewall of the heat dissipation layer being free from the adhesive layer; and a package substrate connected to the conductive connectors.