IC Package Stacking with Configured Leadframes
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in reducing package dimensions, achieving low-cost manufacturing, improving yield, and providing flexible stacking and integration configurations to accommodate the increasing demands of modern electronics.
Innovation Solution
The system involves stacking two integrated circuit packages with configured leadframes, where each package is electrically connected using interconnects like bond wires or solder bumps, allowing for flexible configurations and efficient use of space, and enabling known-good-die (KGD) packages to be assembled without assembly defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple integrated circuit packages are stacked vertically to reduce board space, then the area of stationary object (board space) is reduced, but the device complexity increases due to assembly process difficulties and limited I/O configurations
Solution Approach 1:
The leadframe is divided into multiple segments including a body portion, extension portions, and connection portions that can be independently configured. This segmentation allows each package in the stack to have optimized I/O configurations while maintaining standard packaging, reducing assembly complexity despite vertical stacking
Solution Approach 2:
The patent transitions from traditional 2D horizontal package arrangement to 3D vertical stacking by configuring leadframes with extension portions that protrude from package bodies. This dimensional change enables multiple packages to be stacked while providing flexible I/O routing in three-dimensional space
2Ease of manufacture
If leaded packages are used for stacking, then existing manufacturing methods can be reused, but the leaded packages have limited I/O which restricts flexibility in stacking configurations
Solution Approach 1:
The leadframe design serves multiple functions: it provides mechanical support, electrical connection, and configurable I/O routing. The extension portions can be configured in different patterns to support various stacking arrangements while using standard leaded package manufacturing processes
Solution Approach 2:
The leadframe configuration is made dynamic through the extension portions that can be positioned and routed in different configurations. This allows the same basic package design to adapt to various stacking scenarios without requiring new manufacturing processes
3Productivity
If multi-chip modules are assembled before testing, then assembly can proceed with available components, but defects cannot be identified early leading to lower yield
Solution Approach 1:
Individual integrated circuit packages are tested and validated before being stacked together. This preliminary testing of complete packages rather than individual chips allows defects to be identified early, ensuring only known-good packages are assembled into the final stacked configuration
Data Source
AI summary
An integrated circuit package to package stacking system is provided including providing a first integrated circuit package, having a configured leadframe, providing a second integrated circuit package, having the configured leadframe, and forming an integrated circuit package pair by electrically connecting the configured leadframe of the first integrated circuit package to the configured leadframe of the second integrated circuit package.