3D IC Package Stacking with Coplanar Thermal Dissipation
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in reducing package dimensions, meeting high-speed signaling requirements, and providing effective thermal management while maintaining cost-effectiveness and performance, especially in densely packed consumer and enterprise electronics.
Innovation Solution
The development of a non-inverted internal stacking module system, which includes an internal stacking module substrate with coupled integrated circuits and stacking structures, a base package substrate, and middle structures to control thickness, allowing for efficient package stacking and thermal dissipation within a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple integrated circuits are stacked in a package to reduce board space, then the quantity of circuits per unit area increases, but the package height increases and thermal dissipation becomes poor
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional stacking by introducing vertical interconnect structures (through-silicon vias, solder bumps) that enable circuits to be arranged in multiple layers. This dimensional change allows higher circuit density while managing thermal issues through vertical heat pathways and spaced-apart stacking rather than tight compression.
Solution Approach 2:
The package is segmented into multiple functional layers with intermediate substrates and heat dissipation structures between stacked circuits. This segmentation creates thermal management zones and allows independent optimization of each layer for both electrical and thermal performance.
2Volume of moving object
If package dimensions are reduced to meet space requirements, then board space is saved, but manufacturing precision and assembly difficulty increase
Solution Approach 1:
The patent employs preliminary testing and characterization of die and interconnect structures before final assembly. Pre-aligned substrate structures and pre-formed interconnect patterns are prepared in advance to reduce the precision requirements during the final bonding step, enabling smaller packages with manageable manufacturing tolerances.
3Ease of manufacture
If existing manufacturing methods are reused to reduce cost, then manufacturing cost decreases, but package dimensions cannot be reduced
Solution Approach 1:
The patent designs the packaging structure to serve multiple functions simultaneously: the same substrate and interconnect structures provide both electrical connection and mechanical support, while also incorporating thermal management capabilities. This multi-functionality allows existing manufacturing equipment to produce advanced 3D packages without requiring entirely new process tooling, thus controlling costs while achieving size reduction.
Data Source
AI summary
A method of manufacture of an integrated circuit package system includes: forming a non-inverted internal stacking module including: fabricating an internal stacking module (ISM) substrate having an ISM component side and an ISM coupling side, coupling an internal stacking module integrated circuit to the ISM component side, coupling stacking structures, adjacent to the internal stacking module integrated circuit, on the ISM component side, and molding a stacking module body having a top surface that is coplanar with and exposes the stacking structures; forming a base package substrate under the non-inverted internal stacking module; coupling middle structures between the base package substrate and the ISM coupling side; and forming a base package body on the base package substrate, the middle structures, and the non-inverted internal stacking module including exposing the top surface of the stacking module body to be coplanar with the base package body.