IC Package Stiffener for Thermal and EMI Management
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Solution Overview
Problem
Integrated circuit packages face challenges in cost-effective thermal management, electromagnetic interference (EMI) mitigation, and structural support due to increased heat generation, EMI, and warpage issues as circuit density increases, with existing technologies failing to adequately address these demands.
Innovation Solution
The integration of a stiffener structure with an external interconnect, paddle, and tie bars, which serves as both an EMI shield and heat sink, connected to ground, providing thermal dissipation paths and planar rigidity to mitigate warpage, while using surface mount technology for robust mechanical attachment and enabling cost-effective manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external heat spreaders are used to improve thermal dissipation, then thermal performance is improved, but EMI and warpage problems are not mitigated
Solution Approach 1:
The patent applies multi-functionality by designing a single integrated stiffener structure that simultaneously performs three functions: (1) provides thermal dissipation pathways through thermally conductive material, (2) acts as an EMI shield by being electrically connected to ground, and (3) reduces warpage through mechanical reinforcement. This eliminates the need for separate components for each function and resolves the technical contradiction by making one component serve multiple purposes.
Solution Approach 2:
The patent merges previously separate functions into a single unified stiffener component. The stiffener combines thermal management, EMI shielding, and structural reinforcement functions that were previously addressed by separate components. This integration resolves the contradiction by creating a multi-functional element that addresses all three issues simultaneously rather than treating them separately.
2Temperature
If internal heat sinks are used to improve thermal dissipation, then thermal performance is improved, but EMI and warpage problems are not mitigated
Solution Approach 1:
The stiffener structure serves as a multi-functional component that combines internal heat sink capabilities with EMI shielding and warpage reduction. The thermally conductive material provides heat dissipation pathways, while the electrical connection to ground enables EMI shielding, and the rigid structure prevents warpage. This single component resolves all three issues simultaneously.
Solution Approach 2:
The patent combines internal heat sink functionality with EMI shielding and structural support into a single integrated stiffener. This merging of functions allows the component to address thermal management, electromagnetic interference, and mechanical stability together, resolving the technical contradiction that arose from using separate components.
3Adaptability or versatility
If larger package dimensions are used to accommodate increased I/O, then I/O capacity is improved, but warpage susceptibility increases
Solution Approach 1:
The stiffener structure is installed before final packaging to preemptively counteract warpage forces. By providing rigid mechanical support in advance, the stiffener prevents the large package from warping under thermal and mechanical stresses during subsequent manufacturing and operation, thus resolving the contradiction between large dimensions and warpage resistance.
Solution Approach 2:
The patent changes the mechanical parameters of the package by introducing a stiffener with high rigidity and strength properties. This parameter change in structural reinforcement allows the package to maintain dimensional stability despite increased size, enabling high I/O capacity without suffering from warpage susceptibility.
4Adaptability or versatility
If more circuitry is packed into integrated circuits to increase functionality, then device capability is improved, but heat generation and EMI increase
Solution Approach 1:
The stiffener structure serves as a multi-functional solution that simultaneously addresses heat dissipation and EMI shielding. The thermally conductive material provides heat pathways, while the electrical connection to ground creates an EMI shield. This single component resolves both harmful effects generated by increased circuitry density.
Solution Approach 2:
The stiffener acts as an intermediary component between the integrated circuit and the environment. It provides thermal pathways to conduct heat away from the circuit, creates an electromagnetic shield to contain EMI, and offers mechanical support. This intermediary structure mediates the harmful effects of high-density circuitry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces EMI, enhances thermal performance, and improves structural reliability by providing a robust mechanical connection that withstands warpage forces, allowing for efficient and economical manufacturing of large integrated circuit packages.
Implementation Method 1
enhance the ability of heat being dissipated to the package ambient environment
Implementation Method 2
EMI should not be dissipated to the environment but its energy should be absorbed by the system back to a ground plane
Data Source
AI summary
An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.