IC Package Heat Dissipation Die for Stress and Cracking Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in reducing stress concentration and die cracking in integrated circuit packages due to the iterative reduction of minimum feature size, which leads to thinner semiconductor dies and increased demand for creative packaging techniques.
Innovation Solution
The integration of a heat dissipation die exposed through an encapsulant around integrated circuit devices with lesser thicknesses, along with a heat spreader attached to the top surface of the heat dissipation die, helps reduce encapsulant thickness and improves heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If iterative reduction of minimum feature size is implemented to increase integration density, then more components can be integrated into a given area, but semiconductor dies become thinner and more susceptible to stress concentration and die cracking
Solution Approach 1:
A heat dissipation die is placed between the thinner integrated circuit die and the encapsulant material. This heat dissipation die acts as a cushioning layer with higher mechanical strength and thermal conductivity, preventing stress concentration from propagating to the thinner die while also improving heat dissipation before the stress reaches the vulnerable die structure
Solution Approach 2:
The heat dissipation die serves as an intermediary component between the integrated circuit die and the encapsulant. It mediates the mechanical stress by providing a stronger intermediate layer that prevents direct stress transmission to the thinner die, and simultaneously mediates thermal energy by conducting heat away from the die stack
2Object-affected harmful factors
If encapsulant material is used to protect integrated circuit devices, then devices are enclosed and protected, but excessive encapsulant thickness over thinner dies causes stress concentration and die cracking
Solution Approach 1:
The heat dissipation die is positioned beforehand between the integrated circuit die and the encapsulant material to provide mechanical cushioning. This prevents the encapsulant from directly contacting and stressing the thinner die, absorbing and distributing the mechanical stress before it reaches the vulnerable die structure
Solution Approach 2:
The heat dissipation die acts as an intermediary layer that replaces the need for thick encapsulant material over the die area. It provides both mechanical protection and thermal management, allowing the encapsulant to be thinner while still providing environmental protection
3Temperature
If heat dissipation structures are added to improve thermal management, then heat dissipation efficiency increases, but device complexity and manufacturing steps increase
Solution Approach 1:
The heat dissipation die performs multiple functions simultaneously: it provides thermal management by conducting heat away from the integrated circuit die, mechanical support by preventing stress concentration, and structural alignment by providing a stable mounting surface. This multi-functionality reduces the need for separate components for each function
Solution Approach 2:
The patent combines thermal management and mechanical support functions into a single heat dissipation die component. Instead of having separate heat sinks and structural support elements, the heat dissipation die integrates both functions, simplifying the overall package structure and reducing the number of manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces stress concentration and die cracking by minimizing encapsulant thickness over thinner dies and enhances heat dissipation efficiency through the use of high thermal conductivity materials.
Implementation Method 1
a heat dissipation die on the second integrated circuit device... enhances heat dissipation efficiency through the use of high thermal conductivity materials
Implementation Method 2
a heat spreader attached to the top surface of the heat dissipation die
Data Source
AI summary
In an embodiment, a device includes: an interposer; a first integrated circuit device attached to the interposer; a second integrated circuit device attached to the interposer adjacent the first integrated circuit device; a heat dissipation die on the second integrated circuit device; and an encapsulant around the heat dissipation die, the second integrated circuit device, and the first integrated circuit device, a top surface of the encapsulant being coplanar with a top surface of the heat dissipation die and a top surface of the first integrated circuit device.