IC Package Substrate Elimination for Tighter Design Rules
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Solution Overview
Problem
Conventional flip chip packages require a PCB-based substrate, which is costly and inadequate for tight design rules, limiting their ability to accommodate next-generation electronic devices and increasing production costs.
Innovation Solution
Integrated circuit packages that do not rely on a PCB-based substrate, featuring a redistribution structure coupled to a die via first-level interconnects and solder, with second-level interconnects extending through openings in a solder resist, allowing for tighter design rules and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a PCB-based substrate is used in conventional flip chip packages, then the package can be manufactured with standard processes, but the production cost increases and the ability to accommodate tight design rules is limited
Solution Approach 1:
The patent extracts and eliminates the PCB-based substrate from the conventional flip chip package structure. By removing this substrate dependency, the invention enables direct attachment of the die to the interconnect structure, thereby achieving tighter design rules without being constrained by PCB manufacturing limitations while avoiding the high costs associated with specialized PCB substrates.
Solution Approach 2:
The patent segments the package structure into distinct functional components: the die, the interconnect structure with multiple levels of interconnects, and the encapsulant. This segmentation allows each component to be optimized independently, enabling the use of cost-effective manufacturing processes while achieving precise alignment and tight design rules through the modular interconnect architecture.
2Productivity
If a PCB-based substrate is used in conventional flip chip packages, then the package structure is simple, but the production cost increases and yield decreases
Solution Approach 1:
By extracting the expensive PCB substrate and replacing it with a more cost-effective interconnect structure, the patent reduces material costs and enables higher production volumes. The simplified structure without substrate constraints allows for more efficient manufacturing processes and higher yields.
Solution Approach 2:
The patent changes the fundamental parameters of the package structure by eliminating the substrate layer and adopting a direct interconnect architecture. This parameter change enables cost reduction through simplified materials and processes while improving yield through better manufacturability and fewer assembly steps.
3Adaptability or versatility
If a PCB-based substrate is used, then the package can support current generation devices, but it is inadequate for next-generation electronic devices with tighter pitch
Solution Approach 1:
The patent creates a dynamic and scalable interconnect structure that can adapt to future pitch requirements. The multi-level interconnect architecture with redistribution layers can be reconfigured and scaled to accommodate tighter pitch designs for next-generation devices, providing long-term adaptability without being locked into substrate-specific constraints.
Solution Approach 2:
The interconnect structure serves multiple functions: it provides electrical connections, enables signal redistribution, and offers a scalable platform for different pitch requirements. This universal design eliminates dependence on specific substrate vendors and allows the same basic structure to support both current and next-generation electronic devices with varying pitch specifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables lower production costs, adherence to finer design rules, higher yields, and reduced dependence on substrate vendors, facilitating the development of next-generation electronic devices with tighter pitch capabilities.
Implementation Method 1
The die is coupled to the redistribution structure via first-level interconnects and solder; second-level interconnects coupled to the redistribution structure through openings in the solder resist
Data Source
AI summary
Disclosed herein are integrated circuit (IC) packages, and related structures and techniques. In some embodiments, an IC package may include: a die; a redistribution structure, wherein the die is coupled to the redistribution structure via first-level interconnects and solder; a solder resist; and second-level interconnects coupled to the redistribution structure through openings in the solder resist.