Low Profile IC Package Height Reduction via Substrate Extraction
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Solution Overview
Problem
Current integrated circuit (IC) packages with multiple dies have a high height profile, which is a challenge for integration into smaller devices like mobile and wearable devices, as they require a better form factor and lower fabrication costs while maintaining performance.
Innovation Solution
A low profile IC package design that eliminates the need for a package substrate by using a wire bond and encapsulation layers to connect multiple dies, with a redistribution portion and package interconnects to provide structural support and electrical paths, resulting in a package height of 500 microns or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a package substrate is used to connect multiple dies, then structural support and electrical connections are provided, but the package height increases to 1000 microns or greater
Solution Approach 1:
The patent removes the package substrate from the traditional PoP structure, extracting the unnecessary intermediate layer that increases height. The dies are directly connected through wire bonds and encapsulation layers, eliminating the substrate's height contribution while maintaining structural support and electrical connectivity functions through alternative means.
Solution Approach 2:
The patent merges the functions of structural support and electrical connection into the encapsulation layers and wire bond structure. The encapsulation layers provide both mechanical support and a pathway for electrical connections, combining multiple functions into integrated components rather than separate layers.
2Ease of manufacture
If multiple dies are connected using traditional package on package structure, then electrical connections are established, but fabrication cost increases
Solution Approach 1:
By removing the package substrate, the patent eliminates the associated fabrication steps, materials, and assembly processes required for substrate integration. This extraction of the substrate layer directly reduces fabrication complexity and cost while simultaneously reducing package height.
3Length of stationary object
If package substrate is eliminated, then package height is reduced to 500 microns or less, but structural support must be provided by alternative means
Solution Approach 1:
The encapsulation layers are designed to perform multiple functions simultaneously: providing structural support for the dies, enabling electrical connections through integrated interconnects, and offering mechanical protection. This multi-functionality compensates for the removed substrate's support role.
Solution Approach 2:
The patent employs composite encapsulation structures that combine multiple materials with complementary properties. These composite materials provide enhanced mechanical strength, structural rigidity, and electrical connectivity, replacing the substrate's support function through material composition rather than a single-material substrate layer.
Data Source
AI summary
An integrated circuit (IC) package that includes a first die, a wire bond coupled to the first die, a first encapsulation layer that at least partially encapsulates the first die and the wire bond, a second die, a redistribution portion coupled to the second die, and a second encapsulation layer that at least partially encapsulates the second die. In some implementations, the wire bond is coupled to the redistribution portion. In some implementations, the integrated circuit (IC) package further includes a package interconnect that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package further includes a via that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package has a height of about 500 microns (μm) or less.