IC Package Substrate Conductor-Free Recess Design
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Solution Overview
Problem
Current multi-chip integrated circuit packages face issues with low adhesion of spacer structures and encapsulation materials, leading to delamination and reliability problems, while also being limited by real estate constraints and high costs.
Innovation Solution
A mountable integrated circuit package system is developed, featuring a carrier with a substrate having a conductor-free recess, where the first integrated circuit device is mounted over the carrier, and electrical interconnects are connected under the recess to enhance reliability and reduce package height, with the substrate partially exposed for improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional multi-chip packages with spacer structures are used, then integrated circuit density can be increased, but adhesion problems occur leading to delamination and reliability issues
Solution Approach 1:
The patent removes the problematic spacer structure from the package design. By eliminating the spacer that caused adhesion issues between the substrate and encapsulation material, the invention resolves the delamination problem while maintaining the ability to achieve high integrated circuit density through alternative packaging configurations.
Solution Approach 2:
The patent introduces a substrate with a recess that acts as an intermediary structure between the integrated circuit and the encapsulation material. This recess provides a mechanical interlock feature that improves adhesion and prevents delamination without requiring the problematic spacer structure, thereby mediating between the need for density and the need for reliability.
2Ease of manufacture
If conventional package structures are used, then manufacturing is straightforward, but package height is excessive and real estate is wasted
Solution Approach 1:
The patent transitions from a conventional planar package structure to a three-dimensional structure with a substrate recess. This dimensional change allows the integrated circuit to be positioned lower, reducing overall package height while maintaining ease of manufacture through standard substrate fabrication techniques that can accommodate recess features.
Solution Approach 2:
The substrate recess creates a nested structure where the integrated circuit sits within the recessed area of the substrate. This nesting approach reduces the vertical profile of the package while maintaining a straightforward manufacturing process that builds upon conventional substrate fabrication methods.
3Area of stationary object
If integrated circuits are densely packed, then real estate is optimized, but moisture sensitivity increases
Solution Approach 1:
The substrate recess creates a localized protective environment for the integrated circuit. By concentrating the protective structural feature (the recess) at the specific location where the integrated circuit is mounted, the invention provides targeted protection against moisture while maintaining dense packing across the substrate area.
Data Source
AI summary
A mountable integrated circuit package system includes: providing a carrier; mounting a first integrated circuit device over the carrier; mounting a substrate over the first integrated circuit device with the substrate having a conductor-free recess; connecting a first electrical interconnect under the conductor-free recess electrically connecting the carrier and the first integrated circuit device; and forming a package encapsulation over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate.