IC Package Insulating Substrate Routing Traces Thermal Dissipation
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Solution Overview
Problem
Existing IC packaging methods, particularly those using solder bumps, are limited in heat dissipation and are mainly suitable for packages with lower pin counts, hindering the miniaturization and thermal performance of IC devices.
Innovation Solution
The use of an insulating substrate with electrically conducting upper routing traces to connect lower contact leads to I/O pads on an IC die, allowing for improved thermal and electrical performance through solder joints, and the use of leadframe panels with solder bumps to facilitate efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If solder bumps are used to connect the die to the leadframe, then heat dissipation is improved, but the package is limited to lower pin counts
Solution Approach 1:
The patent transitions from conventional bonding wire connections to a three-dimensional stacked architecture where multiple leadframe panels are vertically arranged and interconnected through through-substrate vias. This vertical stacking enables high pin count connectivity while maintaining the superior heat dissipation characteristics of solder bump connections at each interface.
Solution Approach 2:
The leadframe is divided into multiple separate panels that are stacked vertically. Each panel can be independently connected to the die or to other panels through solder bumps, allowing the heat dissipation benefits to be distributed across multiple connection interfaces while achieving high pin count through the stacked configuration.
2Device complexity
If bonding wires are used to connect the die to the leadframe, then the package structure is simpler, but heat dissipation is reduced
Solution Approach 1:
The patent replaces the mechanical bonding wire system with a solder bump-based electrical and thermal connection system. Solder bumps provide both electrical connectivity and superior thermal conduction paths directly from the die to the leadframe panels, eliminating the thermal bottleneck of narrow bonding wires while maintaining structural integrity.
3Volume of moving object
If the package is miniaturized, then the device size is reduced, but thermal performance deteriorates
Solution Approach 1:
The patent resolves the miniaturization-thermal performance contradiction by stacking leadframe panels vertically to create a three-dimensional configuration. This vertical arrangement provides multiple thermal conduction paths through the stacked panels and their interconnections, enabling efficient heat dissipation from a compact footprint area and maintaining superior thermal performance in miniaturized packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables enhanced thermal dissipation and electrical performance by reducing resistance and increasing current carrying capacity, making it suitable for higher pin count packages and improving overall device stability.
Implementation Method 1
there is, in general, considerable more heat dissipation possible through a solder bump as compared with typically much narrower and longer bonding wires
Implementation Method 2
The traces on the bottom surface of the substrate electrically couple each lower contact lead with an associated I/O pad
Data Source
AI summary
An integrated circuit package is described that includes an integrated circuit die, a plurality of lower contact leads, and an insulating substrate positioned over the die and lower contact leads. The insulating substrate includes a plurality of electrically conducting upper routing traces formed on the bottom surface of the substrate. The traces on the bottom surface of the substrate electrically couple each lower contact lead with an associated I/O pad.